The invention provides a filter
chip prepared by adopting a multi-layer winding
inductor and a preparation method of the filter
chip, and relates to the technical field of filter chips, and the filter
chip comprises an input port bonding pad, an output port bonding pad, the multi-layer winding
inductor and a chip
capacitor; the multi-layer winding
inductor comprises a winding inductor, a
dielectric layer and a
metal ground, the winding inductor is arranged on the upper side of the
dielectric layer, and the
metal ground is arranged on the lower side of the
dielectric layer; the input port bonding pad is connected with the input end of the chip
capacitor and is connected with the multi-layer winding inductor; the output port bonding pad is connected with the output end of the chip
capacitor and is connected with the multi-layer winding inductor; the chip capacitor is connected with the multi-layer winding inductor; the winding inductor comprises top-layer
metal, bottom-layer metal and a substrate, a substrate metal through hole is formed in the substrate, the top-layer metal is located on the upper side of the substrate, the bottom-layer metal is located on the lower side of the substrate, and the top-layer metal and the bottom-layer metal are connected through the substrate metal through hole. The filter chip has the advantages that the
inductance Q value of the filter chip is improved, and the application range of the filter chip is expanded.