Gate sensitive triggering unidirectional controlled silicon chip and production method thereof

A silicon chip and gate technology, applied in the manufacture of electrical components, thyristors, semiconductor/solid-state devices, etc., can solve the problems of poor batch-to-batch repeatability, poor controllability, limitations, etc., to achieve convenient production and processing, improved temperature characteristics, Good batch consistency

Active Publication Date: 2010-09-22
JIANGSU JIEJIE MICROELECTRONICS
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(1) There is a "trigger current I" in the manufacturing process GT Poor consistency and poor control" problem: the I of each batch of products in the manufacturing process GT The discreteness is very large, and the repeatability between batches is also very poor; when customers require I GT = 20-40uA or I GT = 30-50uA or I GT = 40-60uA products, the manufacturer can not meet the requirements; and the customer's favorite is I GT = 20-40uA or I GT = 30-50uA or I GT = 40-60uA products
(2) There are many uses that require I GT = 40-60uA and I GT = 60-80uA products, the current situation cannot meet the requirements
(3) there is a restriction problem of using environment: I GT It decreases with the increase of temperature, and increases with the decrease of temperature, so there is a temperature limit when using it. The junction temperature Tj generally given by the manufacturer is -40 ° C ~ 110 ° C, and the use of customer control The temperature (shell temperature) range is generally -20°C to 65°C; this operating temperature range is not wide enough, which limits the use
(4) At present, when the sensitive trigger one-way thyristor chip is produced domestically or abroad, there is no resistance between the gate (G) and the cathode (K), and the user needs to add an external resistance when using it.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Gate sensitive triggering unidirectional controlled silicon chip and production method thereof
  • Gate sensitive triggering unidirectional controlled silicon chip and production method thereof
  • Gate sensitive triggering unidirectional controlled silicon chip and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] like Figures 1 to 6 As shown, the gate sensitive trigger one-way thyristor chip of the present invention includes gate electrode G1, cathode electrode K2, anode electrode A3, N + Emitter region 4, N-type long base region 5, P-type short base region 6 and P-type anode region 7, an outer groove 8 is etched around the chip, and a section of inner groove 12 is arranged inside the chip, and the inner groove 12 from N + The upper surface of the emitter region opens, passes through the P-type short base region, and opens into the 5 layers of the N-type long base region. A long strip-shaped resistance arm 9 is formed between the inner trench 12 and the outer trench 8, The resistor arm 9 utilizes N + The P-type short base region 6 under the emitter region 4 forms a diffusion resistor R with a larger resistance value GK 10. The diffusion resistance R GK One end of 10 is connected to the gate electrode G1 through the inner lead 11 of the chip, and the other end is connected t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a gate sensitive trigger one-way silicon controlled rectifier (SCR) chip which promotes the temperature characteristics of products and improves batch-to-batch consistency of trigger current IGT. The invention also provides a method for producing the gate sensitive trigger one-way SCR chip; and the method has the advantages of simple process, convenient processing and improving performance of products. The gate sensitive trigger one-way SCR chip comprises a gate electrode G, a cathode electrode K, an anode electrode A, an N<+> emitter region, an N-shaped long base region, a P-shaped short base region and a P-shaped anode region; and an external groove is etched around the chip. The SCR chip is characterized in that a section of internal groove is arranged in the chip, the internal groove and the external groove form a strip-shaped resistance arm, the resistance arm forms a diffused resistor RGK with a larger resistance value by utilizing the P-shaped short baseregion of the N<+> emitter region, one end of the diffused resistor RGK is connected with the gate electrode G by an internal lead of the chip, and the other end is connected with the cathode electrode K by the internal lead.

Description

technical field [0001] The invention relates to a semiconductor chip, in particular to a gate sensitive trigger one-way thyristor chip and a production method thereof. Background technique [0002] An important characteristic of the gate sensitive trigger one-way thyristor is that the gate trigger signal required for use is very small, generally its trigger current I GT The index is ≤200uA, the products sold on the market I GT Generally 5-40uA. (1) There is a "trigger current I" in the manufacturing process GT Poor consistency and poor control" problem: the I of each batch of products in the manufacturing process GT The discreteness is very large, and the repeatability between batches is also very poor; when customers require I GT = 20-40uA or I GT = 30-50uA or I GT = 40-60uA products, the manufacturer can not meet the requirements; and the customer's favorite is I GT = 20-40uA or I GT = 30-50uA or I GT = 40-60uA product. (2) There are many uses that require I GT ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/74H01L21/332
Inventor 王成森黄善兵沈卫群黎重林薛治祥颜呈祥
Owner JIANGSU JIEJIE MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products