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Nanometer micropore thermal insulation plate and manufacturing method thereof

A technology of nano-micropores and manufacturing methods, which is applied in the field of high-temperature-resistant nano-micro-porous heat insulation boards and its manufacturing, can solve the problems of low temperature resistance, limit the use temperature range of nano-micro-porous heat insulation boards, and low thermal conductivity, and achieve Retain low, increase the use temperature range, retain the effect of thermal conductivity

Inactive Publication Date: 2014-08-06
上海依南新材料有限公司
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Problems solved by technology

The thermal conductivity of the nano-microporous heat insulation board mixed and pressed by the above three materials can be made lower, but due to the low temperature resistance of the main material, the final nano-microporous heat insulation board is only suitable for use in a temperature environment below 550°C , which greatly limits the operating temperature range of the nano-microporous heat insulation board, and at the same time does not bring out the best performance advantages of the nano-microporous heat insulation board

Method used

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  • Nanometer micropore thermal insulation plate and manufacturing method thereof
  • Nanometer micropore thermal insulation plate and manufacturing method thereof

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Embodiment Construction

[0020] The following will combine figure 1 , figure 2 The present invention is further described.

[0021] A nano-microporous heat insulation board, which includes silicon dioxide with a particle size range of 5-20nm, silicon carbide with a particle size range of 2-12um, zirconium silicate with a particle size range of 2-15um and a diameter range of 5- 15um high-silica glass fiber, the length of high-silica glass fiber is 5-15mm, and the silicon carbide material can be replaced by other metal oxides such as titanium dioxide and aluminum oxide.

[0022] A method for manufacturing a nano-microporous heat insulation board, comprising the steps of:

[0023] Weigh silicon dioxide, silicon carbide, zirconium silicate, and high-silica glass fiber raw materials by weight;

[0024] Fully mix the prepared raw materials in a high-speed mixer;

[0025] The mixed material is dry-pressed in a special mold of a hydraulic press.

[0026] Wherein the weight ratio range of silicon dioxide...

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Abstract

The present invention discloses a nanometer micropore thermal insulation plate, which comprises silica with a particle size range of 5-20 nm, silicon carbide with a particle size range of 2-12 m, zirconium silicate with a particle size range of 2-15 m, and high silica glass fibers with a diameter range of 5-15 m. The present invention further provides a manufacturing method for the nanometer micropore thermal insulation plate. With the nanometer micropore thermal insulation plate, the use temperature range of the materials is increased, and the low thermal conductivity of the materials is maintained.

Description

technical field [0001] The invention relates to the technical field of heat insulation board manufacturing, in particular to a high-temperature-resistant nano-microporous heat insulation board and a manufacturing method thereof. Background technique [0002] At present, the main materials used by domestic enterprises to manufacture nano-microporous heat insulation panels are: nano-silica, silicon carbide, and alkali-free glass fiber. The thermal conductivity of the nano-microporous heat insulation board mixed and pressed by the above three materials can be made lower, but due to the low temperature resistance of the main material, the final nano-microporous heat insulation board is only suitable for use in a temperature environment below 550°C , which greatly limits the operating temperature range of the nano-microporous heat insulation board, and at the same time does not bring out the best performance advantages of the nano-microporous heat insulation board. Contents of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B30/02
Inventor 周湘中
Owner 上海依南新材料有限公司
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