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Special forming mold for circular tantalum core of tantalum capacitor and using method thereof

A technology of tantalum capacitors and forming molds, which is applied in the field of electronic components production and manufacturing, can solve the problems that tantalum cores with a circular structure cannot be formed, limit the development of electronic components production and manufacturing technology, etc., and achieve simple structure and high pressing quality Good, good batch consistency

Inactive Publication Date: 2017-05-03
长春维鸿东光电子器材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current existing tantalum core forming dies are generally composed of upper and lower punches and a concave die (cavity). Development of Electronic Component Manufacturing Technology Field

Method used

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  • Special forming mold for circular tantalum core of tantalum capacitor and using method thereof
  • Special forming mold for circular tantalum core of tantalum capacitor and using method thereof
  • Special forming mold for circular tantalum core of tantalum capacitor and using method thereof

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specific Embodiment approach 1

[0016] Specific implementation mode one: combine picture 1 ~ picture 7 This embodiment will be described. This embodiment provides a specific implementation of a special molding die for a round tantalum core of a tantalum capacitor. The special molding die for the round tantalum core of the tantalum capacitor consists of an upper punch 1, a concave die 2, a lower punch 3, an adjustment spacer 4, a tantalum wire limiter 5 and an adjustment spacer 6.

[0017] The upper punch 1 is provided with a die circular mating surface-1-1 structure, and the upper punch 1 is also provided with an operation circumferential surface-1-2 structure, and the upper punch 1 is also provided with a mating plane-1-2 structure. 1-3 structure, the upper punch 1 is also provided with an outer chamfer-1-4 structure, the upper punch 1 is also provided with an upper punch molding surface 1-5 structure; the concave mold 2 is provided with a convex Die mating surface one 2-1 structure, said die 2 is al...

specific Embodiment approach 2

[0019] Embodiment 2: This embodiment provides a specific embodiment of the method of using a special forming mold for a round tantalum core of a tantalum capacitor. The method of using the special molding die for the circular tantalum core of the tantalum capacitor is as follows.

[0020] The lower punch 3 is arranged on the operating table, and the lower punch mating surface 4-1 of the adjusting pad 4 cooperates with the concave die circular mating surface 2 3-1 of the lower punch 3 to realize the adjustment pad 4 and The mating connection of the lower punch 3, the punch mating surface 1 2-1 of the die 2 cooperates with the die circular mating surface 2 3-1 of the lower punch 3 to realize the cooperation of the die 2 and the lower punch 3 Connected, the punch matching surface 1-2-1 of the die 2 and the lower punch molding surface 3-3 of the lower punch 3 form a semi-closed circular molding cavity, pour tantalum powder into the semi-closed molding cavity and place the tantalum...

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Abstract

The invention discloses a special forming mold for the circular tantalum core of a tantalum capacitor and a using method thereof in order to solve the technical problem that most of the tantalum cores formed by the existing forming mold are of a long and thin cylindrical structure and a circular tantalum core cannot be formed using the existing forming mold is solved. The forming mold comprises an upper convex mold, a concave mold, a lower convex mold, an adjusting cushion block, a tantalum wire limiting block, and adjusting gaskets. The adjusting cushion block matches the lower convex mold. The concave mold matches the lower convex mold. The concave mold and the lower convex mold constitute a semi-closed circular forming cavity. Tantalum powder is poured into the semi-closed circular forming cavity, and a tantalum wire is placed on the tantalum powder. The tantalum wire limiting block is used for limiting the tantalum wire. After the tantalum wire is limited, tantalum powder is poured into the cavity. The upper convex mold matches the concave mold. The upper convex mold, the concave mold and the lower convex mold constitute a closed circular forming cavity to form a circular tantalum core through pressing. Adjusting gaskets of appropriate size can be selected according to the size of a tantalum core to realize layered pressing. The special forming mold for the circular tantalum core of a tantalum capacitor has the advantages of simple structure, good pressing quality, good batch consistency, convenient de-molding, and the like, and has a wide application prospect in the technical field of electronic component production and manufacture.

Description

technical field [0001] The present invention relates to Special molding die for round tantalum core of tantalum capacitor and using method thereof , belonging to the technical field of electronic component manufacturing. Background technique [0002] With the rapid progress of electronic technology, the replacement speed of digital electronic products is getting faster and faster, which drives the rapid development of the capacitor industry, and at the same time puts forward higher technical requirements for the production quality and performance of capacitor products. In particular, tantalum capacitors have received extensive attention in the field of electronic components technology due to their technical advantages such as stable electrical performance, high reliability, large storage capacity, and good stability, especially in the technical fields of aerospace and military supporting equipment. The technical requirements for tantalum capacitors are gradually developing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00
Inventor 张大义董宝刚李杰李慧张邦成
Owner 长春维鸿东光电子器材有限公司
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