Inter-board perpendicular interconnection circuit structure for substrate integrated ridge waveguide
A technology of substrate integration and circuit structure, applied in the direction of circuits, waveguide devices, electrical components, etc., can solve the problems of large volume, unfavorable high-density integration, increased circuit volume and weight, etc.
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[0017] refer to figure 1 and figure 2 . In the embodiment described below, a substrate-integrated ridge waveguide interconnection circuit structure includes two LTCC multilayer circuit boards 1 with the same conversion circuit structure, and the SIRW3 interface is metal-etched on the surface of the substrate. The waveguide wall of SIRW3 and the single-sided equivalent dielectric waveguide ridge 10 in the waveguide, the waveguide short-circuit surface 5, and the 50-ohm stripline 8 and stripline connected through the high-resistance stripline 9 are equivalently constituted by the metallization filling hole 2 Probe 6, wherein: on the LTCC multilayer circuit board 1, SIRW3 perpendicular to the substrate surface is integrated, and a substrate integrated ridge waveguide opening is etched on the metal ground on the surface of the LTCC multilayer circuit board 1 corresponding to the exit; Z-direction metallization The filling hole 2 is equivalent to forming the waveguide wall...
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