Method for cutting silicon chips

Abstract

The invention discloses a method for cutting silicon chips, which comprises the following steps: controlling a pay-off spool driving motor, a take-up spool driving motor, a first guide wheel driving motor and a second guide wheel driving motor to rotate synchronously and inversely by a control system after the pay-off spool driving motor drives a pay-off spool to positively pay off wires for 250m-270m; and controlling the four motors to rotate positively again by the control system after the take-up spool driving motor drives a take-up spool to reversely pay off wires for 60m-70m. A silicon rod is cut back and forth in this way repeatedly like a saw blade dragging type, and because a cutting line moves forward for a certain distance and then moves backward for a certain distance, the utilization ratio of the cutting line is efficiently enhanced without breaking the cutting line. Because the silicon rod is cut back and forth, the thickness up and down each silicon chip is uneven when cutting the silicon rod positively, but the direction of each silicon chip can be effectively corrected in reverse cutting, and thus the thickness difference up and down each silicon chip is greatly reduced so as to enhance the quality of the silicon chips.

Description

technical field [0001] The invention relates to a silicon wafer, in particular to a silicon wafer cutting method. Background technique [0002] With the shortage of energy, more and more people pay attention to photovoltaic power generation, and the market demand for silicon wafers of solar cells is also increasing. Silicon wafers for solar cells are made by cutting square monocrystalline silicon rods into thin slices. However, due to the high price of silicon crystal materials, especially in China, silicon crystal materials are extremely scarce. competitiveness is crucial. [0003] In order to reduce the cost of silicon wafers for solar cells, it is necessary to cut more silicon wafers from a square monocrystalline silicon rod, that is, to make each silicon wafer as thin as possible. Requirements, but also makes the traditional blade cutting method eliminated. Silicon wafer multi-wire cutting technology is a relatively advanced silicon wafer processing technology in the ...

AI Technical Summary

Problems solved by technology

Compared with other traditional cutting technologies, the above-mentioned silicon wafer cutting technology has the advantages of high efficiency, high productivity, and high precision. During the cutting process, the rod is always directional, and it takes about 8 hours to complete the cutting, which causes a large cumulative deviation of the cutting line, which will lead to uneven thickness of the silicon wafer obtained by cutting, or silicon wafers. The quality of the two surfaces of the wafer is not ideal, which ultimately affects the yield of the silicon wafer. On the other hand, the cutting line of this cutting method is always directional during the cutting process of the silicon rod. line, so that the number of wafer cuts per unit length of the cutting line is low

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