High-speed transmission optical module and manufacturing method thereof

Abstract

The invention relates to a high-speed transmission optical module and a manufacturing method thereof. In order to effectively integrate and isolate differential signal lines in the high-speed transmission optical module, the optical module comprises a multi-layer circuit overlapping body of a specific circuit board structure, and the multi-layer circuit overlapping body is provided with first anti-crosstalk guard posts between multiple groups of paired differential signal lines; the plurality of isolation layers are arranged in rows along the line extension direction and are respectively and convexly combined to the grounding surfaces in the adjacent isolation layers; when the differential signal line is formed in different layers of the circuit board in a segmented mode, a via hole penetrates through an isolation layer of the circuit board and is electrically connected with a first section and a second section of the differential signal line, and meanwhile a plurality of second anti-crosstalk guard columns extending in the direction parallel to the via hole are further arranged around the via hole and combined to a ground plane in the isolation layer in a penetrating mode, so as to consolidate the peripheral insulating material.

Description

[0001] The present invention is a divisional application. The basis of the divisional application is the Chinese invention patent application with the application date of 2020.06.18 and the application number 202010339662.7. The title of the invention is "high-speed transmission optical module circuit board structure and its manufacturing method, and crosstalk prevention method". technical field [0002] The invention relates to the technical field of internal devices of a high-speed transmission optical module, in particular to a high-speed transmission optical module and a manufacturing method thereof. Background technique [0003] High-speed transmission optical modules, such as single / dual-fiber pluggable optical modules (SFP) are small pluggable transceiver devices that contain active chips and optical receiving transmitters. They are used in high-speed telecommunications and data communications. In order to match 5G, 6G or Under more advanced communication protocols, th...

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Problems solved by technology

In addition to the differential signal line pair buried in the blind hole, the first signal transmission layer (top differential signal line) is connected to the gold finger on the top layer, and the second signal transmission layer (bottom surface differential signal line) is connected to the bottom gold finger. It helps to avoid the concentrated crosstalk between the differential signal lines on the first signal transmission layer and the differential signal line pairs on the second signal transmission layer; the differential signal lines on the surface are located in the hollow pattern of the ground plane of the same layer, which is very important for the optical module The small printed circuit boards used do not have sufficient mechanical strength, and the problem of layer peeling due to heat generation during the operation of high-transmission optical modules is prone to occur

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