High-speed transmission optical module circuit board structure, manufacturing method, and crosstalk prevention method

Abstract

It relates to a high-speed transmission optical module circuit board structure, its manufacturing method, and a crosstalk prevention method. In order to effectively integrate and isolate differential signal lines in the high-speed transmission optical module, the circuit board structure includes a multi-layer circuit laminate, which is arranged on both sides of the plug-in side The row contact means that the multi-layer circuit laminate includes a transmission signal layer, a control signal layer, a power signal layer and an integrated circuit layer for partition management separated by an isolation layer, and a pair of first differential signal lines and a pair of second differential signal lines. The first segment of the differential signal line is located in the transmission signal layer, and the first differential signal line is connected to the first row of contact fingers; the second segment of the second differential signal line is located in the first area of ​​the integrated circuit layer and connected to the corresponding second row Contact fingers; electrically connect the first section and the second section of the second differential signal line with long connection via holes; electrically connect the rest of the second row of contact fingers to the corresponding control signal layer and power signal layer with short connection via holes ; The integrated circuit layer also includes the power line connection section, the control line connection section and the ground cooling island located in the second area.

Description

technical field [0001] The invention relates to the technical field of internal devices of high-speed transmission optical modules, in particular to a high-speed transmission optical module circuit board structure, a manufacturing method thereof, and a crosstalk prevention method. Background technique [0002] High-speed transmission optical modules, such as single / dual-fiber pluggable optical modules (SFP) are small pluggable transceiver devices that contain active chips and optical receiving transmitters. They are used in high-speed telecommunications and data communications. In order to match 5G, 6G or Under more advanced communication protocols, the amount of data that needs to be transmitted within a limited time is also increasing, and the transmission rate is increased to 100 Gb / s or higher. In order to correct / correct the distortion or delay of data data at high transmission rates, the circuit board Differential signal lines are used in the structure for high-speed d...

AI Technical Summary

Problems solved by technology

In addition to the differential signal line pair buried in the blind hole, the first signal transmission layer (top differential signal line) is connected to the gold finger on the top layer, and the second signal transmission layer (bottom surface differential signal line) is connected to the bottom gold finger. It helps to avoid the concentrated crosstalk between the differential signal lines on the first signal transmission layer and the differential signal line pairs on the second signal transmission layer; the differential signal lines on the surface are located in the hollow pattern of the ground plane of the same layer, which is very important for the optical module The small printed circuit boards used do not have sufficient mechanical strength, and the problem of layer peeling due to heat generation during the operation of high-transmission optical modules is prone to occur

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