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Recycling method of discarded circuit board

A technology for waste circuit boards and circuit boards, which is applied in the field of recycling and reuse of waste circuit boards, can solve the problems of low recycling rate and secondary pollution of waste circuit boards, achieve no secondary pollution, increase added value, and simplify Effects of crushing and separation processes

Inactive Publication Date: 2012-07-04
BEIHANG UNIV
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AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problem of low recycling rate of existing waste circuit boards and secondary pollution, and proposes a comprehensive method for recycling and reusing waste circuit boards. The circuit board substrate, solder and components are separated and recycled, and then the components are classified and tested. The substrate and functional loss components are respectively broken and separated, and recycled and reused, achieving the purpose of comprehensive recycling of circuit boards, and Realized full resource recycling of circuit boards, no waste generated after classified treatment, no secondary pollution

Method used

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  • Recycling method of discarded circuit board
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  • Recycling method of discarded circuit board

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Embodiment Construction

[0035] The method for recycling and reusing waste circuit boards provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] The recovery and reuse method of the waste circuit board, the flow chart is as follows figure 1 As shown, it mainly includes the following implementation steps:

[0037] Step 1. Non-destructive dismantling of discarded circuit boards;

[0038] The non-destructive disassembly of the circuit board is realized on non-destructive disassembly equipment. The non-destructive dismantling equipment includes a loading unit, a preheating unit, a heating vibration unit, an unloading unit, a conveying unit and a recovery unit, and the circuit board is sequentially transported to the loading unit, the preheating unit through the transmission chain on the conveying unit , Heating vibration unit and dismounting unit to realize the dismantling of the circuit board, and finally collect the dismantled solder...

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Abstract

The invention discloses a recycling method of discarded circuit boards, comprising the following steps: disassembling a discarded circuit board into three parts: a base plate, components and solder, then carrying out sorting and rapid detection on disassembled components; respectively crushing and separating the base plates and various loss-of-function components, and recycling the crushed and separated various powders, wherein the metal powder can be directly reused, and the recycled non-metal powder is used for being prepared into compound material. The method provided by the invention can realize sorting recycling of all resources of the discarded circuit boards; the recycled material can be reused, and therefore, the secondary pollution can not be generated.

Description

technical field [0001] The invention belongs to the technical field of recovery and reuse, and relates to a method for recovery and reuse of waste circuit boards. Background technique [0002] With the implementation of my country's sustainable development strategy, higher requirements are put forward for environmental protection. The recycling and utilization of e-waste has become a thorny issue faced by most countries. At present, my country has become a big country in the production and consumption of household appliances. Based on the calculation of 2% of annual scrapping and renewal, 20 million of the four major categories of household appliances are eliminated every year. In addition, the update cycle for popular use in the whole society is only 2-4 years. Computers, mobile phones and other high-tech electronic products, as well as new home appliances with high quality and low price, have made the actual annual scrapping and updating of household appliances in my count...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B09B3/00B23K1/018B07C5/00B02C23/08B02C23/20B02C23/00
CPCY02W30/82
Inventor 吴国清张宗科赵玉振吴超章李琳
Owner BEIHANG UNIV
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