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High-power LED light fitting based on MEMS micro-cooling device radiation

A technology of LED lamps and cooling devices, which is applied in the direction of cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., which can solve the problems of difficulty in guaranteeing service life, affecting the use effect, and unsatisfactory heat dissipation effect of high-power LED lamps, etc. problem, to achieve the effect of compact structure, improved heat dissipation efficiency, and good heat dissipation effect

Inactive Publication Date: 2010-02-10
JIANGSU MINGJIAHUI ELECTRICAL EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a high-power LED lamp based on MEMS micro-cooling device for heat dissipation due to the unsatisfactory heat dissipation effect of the current high-power LED lamp, which affects the use effect and is difficult to guarantee the service life.

Method used

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  • High-power LED light fitting based on MEMS micro-cooling device radiation
  • High-power LED light fitting based on MEMS micro-cooling device radiation
  • High-power LED light fitting based on MEMS micro-cooling device radiation

Examples

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Embodiment 1

[0024] Such as figure 1 , 3 , 4 shown.

[0025] A high-power LED lamp based on a MEMS micro-cooling device for heat dissipation, including a PCB board 5 for installing LED chips, and the side of the PCB board 5 that is not equipped with LED chips is connected to the bottom phase of the diamond matrix 3 phases. The diamond substrate 3 is provided with a continuous S-shaped microfluid cooling channel 1 (such as Figure 4 ), the microfluid cooling channel 1 is equipped with a sealing plate 2, and the sealing plate 2 is provided with a microfluid inlet hole 7 and a microfluid outlet hole 8 communicating with the microfluid cooling channel 1, and the microfluid is installed in the microfluid cooling channel 1. The flow takes away the heat emitted by the LED chip during use and conducted to the diamond substrate 3 . During specific implementation, the diamond matrix 3 can be bonded and connected with the PCB board 5 on which the LED chip is installed through the thermally conduct...

Embodiment 2

[0027] Such as figure 2 , 3 , 4 shown.

[0028] A high-power LED lamp based on a MEMS micro-cooling device for heat dissipation, including a PCB board 5 for installing LED chips, and the side of the PCB board 5 that is not equipped with LED chips is connected to the bottom phase of the diamond matrix 3 phases. The diamond substrate 3 is provided with a continuous S-shaped microfluid cooling channel 1 (such as Figure 4 ), the microfluid cooling channel 1 is equipped with a sealing plate 2, and the sealing plate 2 is provided with a microfluid inlet hole 7 and a microfluid outlet hole 8 communicating with the microfluid cooling channel 1, and the microfluid is installed in the microfluid cooling channel 1. The flow takes away the heat emitted by the LED chip during use and conducted to the diamond substrate 3 . During specific implementation, the diamond matrix 3 can be bonded to the PCB board 5 for installing the LED chip by connecting bolts 6, such as figure 2 shown. M...

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Abstract

The invention relates to a high-power LED light fitting based on MEMS micro-cooling device radiation, comprising a PCB (5) used for installing an LED chip. The high-power LED light fitting is characterized in that one surface of the PCB (5), which is not provided with the LED chip, is connected with the bottom of a diamond basal body (3); a microfluid radiation channel (1) is arranged on the diamond basal body (3); a sealing board (2) is arranged on the microfluid radiation channel (1); and a microfluid inlet (7) and a microfluid outlet (8) which are communicated with the microfluid radiationchannel (1) is arranged on the sealing board (2). Heat emitted and conducted to the diamond basal body (3) during the use of the LED chip is taken away by the flow of microfluid on the microfluid radiation channel (1). The invention has reasonable design, compact structure, easy manufacture and good radiation effect. The heat emitted when a super-power LED works can be quickly transferred, so theradiation demand of the high-power LED light fitting can be effectively satisfied, and industrial large scale production can be realized on super-power LED street lights. Experiments prove that the radiation efficiency can be increased by more than 50%.

Description

technical field [0001] The invention relates to a high-power LED lamp, especially a design and manufacturing process of a high-power LED lamp that integrates microfluidic control technology, micro-electromechanical system, micro-heat exchange technology and LED lamp manufacturing technology. It belongs to micro-manufacturing, The technical field where surface modification technology and micro-optical technology intersect, specifically a high-power LED lamp based on MEMS micro-cooling device for heat dissipation. Background technique [0002] With the rise of gallium nitride-based third-generation semiconductors and the successful research of blue and white light-emitting diodes, semiconductor lighting has brought another leap in the history of human lighting. Compared with incandescent lamps and fluorescent lamps, LED has become one of the main development directions of a new generation of environmentally friendly lighting sources because of its small size, full solid state,...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00H01L23/473F21Y101/02F21Y103/10F21Y115/10
Inventor 朱纪军洪思忠樊世才
Owner JIANGSU MINGJIAHUI ELECTRICAL EQUIP
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