High-power LED light fitting based on MEMS micro-cooling device radiation

A technology of LED lamps and cooling devices, which is applied in the direction of cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., which can solve the problems of difficulty in guaranteeing service life, affecting the use effect, and unsatisfactory heat dissipation effect of high-power LED lamps, etc. problem, to achieve the effect of compact structure, improved heat dissipation efficiency, and good heat dissipation effect

Inactive Publication Date: 2010-02-10
JIANGSU MINGJIAHUI ELECTRICAL EQUIP
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AI-Extracted Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a high-power LED lamp based on MEMS micro-cooling device for heat dissipation due to the un...
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Method used

A kind of realization mode of invention is that micro-cooling device and LED device are fixed on the same side of PCB board, by aluminum plate heat conduction, the air of lamp chamber sucks micro-cooling device, cold air and micro-cooling device carry out heat exchange and become hot air in Dissipate to the outside through the opening of the wall of the lamp cavity to achieve the purpose of heat dissipation.
[0029] The present invention is a solution to the heat dissipation design of high-power LED street lamps. The LED is fixed on the PCB substrate of aluminum-based material, and at the same time, on the other side of ...
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Abstract

The invention relates to a high-power LED light fitting based on MEMS micro-cooling device radiation, comprising a PCB (5) used for installing an LED chip. The high-power LED light fitting is characterized in that one surface of the PCB (5), which is not provided with the LED chip, is connected with the bottom of a diamond basal body (3); a microfluid radiation channel (1) is arranged on the diamond basal body (3); a sealing board (2) is arranged on the microfluid radiation channel (1); and a microfluid inlet (7) and a microfluid outlet (8) which are communicated with the microfluid radiationchannel (1) is arranged on the sealing board (2). Heat emitted and conducted to the diamond basal body (3) during the use of the LED chip is taken away by the flow of microfluid on the microfluid radiation channel (1). The invention has reasonable design, compact structure, easy manufacture and good radiation effect. The heat emitted when a super-power LED works can be quickly transferred, so theradiation demand of the high-power LED light fitting can be effectively satisfied, and industrial large scale production can be realized on super-power LED street lights. Experiments prove that the radiation efficiency can be increased by more than 50%.

Application Domain

Technology Topic

OptoelectronicsStreet light +3

Image

  • High-power LED light fitting based on MEMS micro-cooling device radiation
  • High-power LED light fitting based on MEMS micro-cooling device radiation
  • High-power LED light fitting based on MEMS micro-cooling device radiation

Examples

  • Experimental program(2)

Example Embodiment

[0023] Example one.
[0024] Such as figure 1 , 3 , 4 shown.
[0025] A high-power LED lamp based on the heat dissipation of a MEMS micro-cooling device includes a PCB board 5 for mounting LED chips. The side of the PCB board 5 on which the LED chip is not mounted is connected to the bottom of the diamond substrate 3. The diamond substrate 3 is provided with a continuous S-shaped microfluidic heat dissipation channel 1 (such as Figure 4 ), a sealing plate 2 is installed on the microfluidic heat dissipation channel 1, and the sealing plate 2 is provided with a microfluidic inlet 7 and a microfluidic outlet 8 communicating with the microfluidic heat dissipation channel 1. The flow takes away the heat emitted and conducted to the diamond substrate 3 during the use of the LED chip. In specific implementation, the diamond substrate 3 can be bonded and connected to the PCB board 5 where the LED chip is mounted through the thermally conductive glue 4, such as figure 1 Shown. The microfluid can use a high-conductivity medium (heat medium oil, water), and the height of the diamond micro matrix 3 is 10 to 500 microns, such as image 3.

Example Embodiment

[0026] Example two.
[0027] Such as figure 2 , 3 , 4 shown.
[0028] A high-power LED lamp based on the heat dissipation of a MEMS micro-cooling device includes a PCB board 5 for mounting LED chips. The side of the PCB board 5 on which the LED chip is not mounted is connected to the bottom of the diamond substrate 3. The diamond substrate 3 is provided with a continuous S-shaped microfluidic heat dissipation channel 1 (such as Figure 4 ), a sealing plate 2 is installed on the microfluidic heat dissipation channel 1, and the sealing plate 2 is provided with a microfluidic inlet 7 and a microfluidic outlet 8 communicating with the microfluidic heat dissipation channel 1. The flow takes away the heat emitted and conducted to the diamond substrate 3 during the use of the LED chip. During specific implementation, the diamond substrate 3 can be bonded and connected to the PCB board 5 where the LED chip is mounted through the connecting bolt 6, such as figure 2 Shown. The microfluid can use a high-conductivity medium (heat medium oil, water), and the height of the diamond micro matrix 3 is 10 to 500 microns, such as image 3.
[0029] The invention is a heat dissipation design for solving high-power LED street lamps. The LED is fixed on the PCB substrate made of aluminum-based material. At the same time, on the other side of the PCB board, a miniature cooling device designed and manufactured by diamond-based material is fixedly connected, and the PCB board and the diamond cooler are bonded by high thermal conductivity glue. During the use of the LED lamp, the heat emitted by the LED is transferred to the pin-connected aluminum plate of the PCB through the pins, and the excessive heat of the aluminum plate is transferred to the diamond micro-radiator through the thermal conductive glue. The air in the lamp room takes away the heat of the LED through the micro heat dissipation device, so as to achieve the purpose of reducing the heat of the LED lamp.
[0030] Another implementation method of the invention uses a microfabrication method to directly manufacture a micro cooling device on the PCB board, and directly solder the LED pins with the PCB board. The micro-cooling device is obtained by micro-electroforming and depositing diamond coating.
[0031] One way to realize the invention is that the micro cooling device and the LED device are fixed on the same side of the PCB board and conduct heat through the aluminum plate. The air in the lamp cavity is sucked into the micro cooling device, and the cold air exchanges heat with the micro cooling device to become hot air passing through the lamp cavity The opening of the wall radiates to the outside to achieve the purpose of heat dissipation.
[0032] The present invention is a diamond-based microfluidic cooling device. The microfluid is a highly conductive medium (heat medium oil, water). The size of the diamond microfluidic device is between 10 microns and 500 microns.
[0033] In the microfluid-based heat sink device of the present invention, the diamond film can be obtained by microwave plasma chemical vapor deposition, hot filament chemical vapor deposition, low temperature plasma assisted chemical vapor deposition, physical vapor deposition and other methods.
[0034] The base material of the present invention can be a diamond film or a diamond-like carbon film.
[0035] The thermal conductive diamond film of the present invention can be obtained on the surface of a micro device by a nano-diamond electroplating/electroforming method.
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PUM

PropertyMeasurementUnit
Height10.0 ~ 500.0µm
tensileMPa
Particle sizePa
strength10

Description & Claims & Application Information

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