Method for rapidly overhauling PCBA line fault of mobile phone

A technology for line faults and mobile phones, applied in the field of rapid maintenance of mobile phone PCBA circuit faults, can solve problems such as increasing maintenance costs, failure to start up, and difficulty in disconnection, and achieve the effects of saving maintenance costs, easy detection and maintenance, and improving maintenance efficiency.

Inactive Publication Date: 2010-02-10
SHANGHAI WINGTECH ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, the integration of mobile phone communication chips with various functions is getting higher and higher, and they are basically packaged in BGA, while the PCB boards of mobile phones are all about 6 to 8 layers, and the layers are very tightly combined, making it difficult to find faults.
In the process of mobile phone PCBA production, we often encounter bad phenomena such as BGA chip soldering and PCB board disconnection, which cause failures such as failure to download programs, failure to boot, etc.
Due to the many control lines, address lines, and data lines

Method used

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  • Method for rapidly overhauling PCBA line fault of mobile phone
  • Method for rapidly overhauling PCBA line fault of mobile phone
  • Method for rapidly overhauling PCBA line fault of mobile phone

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[0016] The specific embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, but the protection scope of the present invention should not be limited by this.

[0017] The present invention provides a method for quickly checking and repairing PCBA circuit faults of mobile phones, and its operation flow is as follows figure 1 Shown. In the embodiment of the present invention, taking repairing the defective LCD display of a mobile phone as an example, the operation method is as follows:

[0018] (1) Take the PCBA board 20 with poor LCD display and disconnect all its power supplies;

[0019] (2) Adjust the digital multimeter 10 to the diode measurement position, such as figure 2 Shown

[0020] (3) Connect the red test lead 11 of the digital multimeter 10 to the ground wire GND of the PCBA board, and connect the black test lead 12 of the digital multimeter 10 to the LCD data signal test point 21;

[0021] ...

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Abstract

The invention provides a method for rapidly overhauling a PCBA line fault of a mobile phone, comprising the following steps: taking out poor PCBA boards and turning off all power sources thereof; selecting a diode measuring shift of a digital multimeter; connecting a red pen-shaped meter of the digital multimeter with the ground wire of the PCBA board and connecting a black pen-shaped meter of thedigital multimeter with a data signal point to be tested; observing the voltage display of the digital multimeter; confirming that the digital multimeter has a voltage display of 0.4-0.8V if the tested data signal and the relevant chip line and PCB board are under normal state, and confirming that the multimeter has no display if the tested data signal and the relevant chip line or PCB board aredisconnected; and measuring other data signals in turn to check where the fault point occurs.

Description

technical field [0001] The invention belongs to the field of mobile communication, and in particular relates to a method for quickly checking and repairing the faults of PCBA lines of mobile phones. Background technique [0002] At present, the integration of mobile phone communication chips with various functions is getting higher and higher, and they are basically packaged in BGA, while the mobile phone PCB board has about 6 to 8 layers, and the layers are very tightly combined, making it difficult to find faults. In the process of mobile phone PCBA production, we often encounter bad phenomena such as BGA chip soldering and PCB board open circuit, resulting in failure to download programs, failure to boot and other failures. Due to the many control lines, address lines, and data lines of the chip, coupled with the peripheral circuits, it is very difficult to accurately and quickly determine which signal point is disconnected from the PCB. At present, maintenance personnel...

Claims

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Application Information

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IPC IPC(8): G01R31/02G01R31/00G02F1/13
Inventor 陈明剑
Owner SHANGHAI WINGTECH ELECTRONICS TECH
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