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Multilayer electronic parts and method thereof

A technology of electronic components and conductive terminals, applied in the direction of resistor components, printed circuit components, fixed capacitor components, etc., can solve problems such as no occurrence, achieve low ESR, improve mechanical strength, and simple design

Inactive Publication Date: 2010-02-24
AVX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] Although various aspects and alternative features are known in the field of multilayer electronic components and related manufacturing methods, a design that addresses all of the issues discussed here has not yet emerged

Method used

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  • Multilayer electronic parts and method thereof
  • Multilayer electronic parts and method thereof
  • Multilayer electronic parts and method thereof

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Embodiment Construction

[0100] The subject matter relates to improved component designs for decoupling capacitors that selectively incorporate closely spaced terminal gaps and / or vertically oriented electrodes to provide parts with relatively low inductance and low ESR.

[0101] As mentioned in the Background of the Invention section above, many known systems and methods have aimed at forming multilayer electronic components characterized by low inductance values ​​and / or low ESR values. Examples of this known technique include components incorporating one or more of inverted geometry terminals, interdigitated capacitor electrodes, or ball grid arrays with alternating current flow in adjacent electrodes. The gist of each of the above methods is to minimize the current-carrying loop formed between the capacitor and its mounting location. Assuming that the mounting location corresponds to a conventional circuit board, this current-carrying path is formed in part by the following individual features: th...

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Abstract

This invention disclosed multilayer electronic parts and method thererof. Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, defining a narrow and controlled spacingbetween the lands that is intended to reduce the current loop area, thus reducing the component inductance. Further reduction in current loop area and thus component equivalent series inductance (ESL) may be provided by interdigitated terminations. Terminations may be formed by various electroless plating techniques, and may be directly soldered to circuit board pads.

Description

technical field [0001] The present invention relates generally to improved component designs for decoupling capacitors that generally result in devices characterized by relatively low cost, low inductance, and low equivalent series resistance (ESR). Background technique [0002] As switching speeds increase and pulse rise times decrease in electronic circuit applications, the need to reduce inductance becomes an important constraint to improve system performance. Even decoupling capacitors used as local energy sources can generate unacceptable voltage spikes V=L(di / dt). Therefore, in high-speed circuits where (di / dt) can be quite large, the magnitude of potential voltage spikes can only be reduced by reducing the value of the inductor L. [0003] The prior art includes several strategies to reduce the equivalent series inductance, or ESL, of chip capacitors compared to standard multilayer chip capacitors. A first exemplary strategy involves inverting the geometry of the te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/005H01G4/06
CPCH01C1/148H01G4/30H01G4/232H01C7/18H05K1/0231H05K2201/0792H01G2/065H01G4/012H05K1/113Y10T29/435H01G4/228
Inventor 安德鲁·P·里特约翰·L·高尔瓦格尼
Owner AVX CORP
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