Structure for re-wiring layer on soft film flip chip encapsulation

Abstract

The invention provides a structure for re-wiring layer on soft film flip chip encapsulation, belonging to class of electronic information. The invention is mainly constructed by a substrate and a chip, one side of the substrate is provided with a plurality of first junction points, while the side of the chip corresponding to the substrate is also provided with second junction points correspondingto the first junction points, and can be bonded by using pressurizing and heating mode or an adhesive layer having conductive particles, then a sealing wax layer is used for covering the chip and bonding with the substrate, wherein the chip comprises a plurality of lugs, the lugs are electrically connected with the aluminum pad via a wiring layer respectively, and the area and interval of the lugsare larger than those of the aluminum pad, therefore, the lugs whose area and interval are larger than those of the aluminum pad can be used for increasing pressurization force and contact area, notonly avoiding burst due to over-pressurization but also leading the chip to be easy to arrange on the inner pins of the substrate.

Description

technical field [0001] The present invention relates to electronic information, in particular to a structure for rewiring layers on soft film flip-chip packages, especially to a rewiring method that increases the contact area of ​​bumps so that chips can be easily placed on the inner pins of soft boards. The wiring layer is in the structure of the soft film flip chip package. Background technique [0002] SIM card, also known as subscriber identification card, is actually a smart card containing large-scale integrated circuits. The card records personal data information of mobile phone users. SIM card is a combination of mobile phone and simulated mobile phone. One of the important distinguishing signs of mobile phones, the mobile phone can only be effective after installing the SIM card, otherwise it can only dial the emergency number approved by the network center, such as 110, 119 and so on. When the SIM card is inserted into any mobile phone that meets the specification...

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a structure of rewiring layer in soft film flip-chip packaging, which solves the problem that the distance between the existing chip and the aluminum pad is short and the force-bearing area is small, so not only the production efficiency is reduced, but also the chip is placed on the When the inner pin of the substrate is on, it is easy to cause the problem of cracking the aluminum pad

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