Silver-coated ball and method for manufacturing same
A manufacturing method and silver cladding technology, applied in manufacturing tools, printed circuit manufacturing, final product manufacturing, etc., can solve the problems of ball deformation, cannot be soldered in high temperature area, etc., and achieve the effect of improving joint strength
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Embodiment approach
[0047] figure 1 is a cross-sectional view of the silver-coated ball 10 according to the embodiment of the present invention. Such as figure 1 As shown, the silver-coated ball 10 of the present embodiment has a spherical core 1 and a coating layer 2 containing silver ultrafine particles having an average particle diameter of 1 nm to 50 nm and provided so as to surround the core 1 .
[0048] In the silver-coated ball 10 of the present embodiment, the surface of the core 1 is coated with silver ultrafine particles having the above average particle diameter. The silver ultrafine particles have a melting point in the range of about 250°C to about 300°C, and soldering can be performed in a high temperature range. Furthermore, the silver melted by heating does not re-melt up to the melting point of silver (approximately 960° C.), so it is possible to provide a semiconductor package that is extremely excellent in bondability to silver-coated balls even at high temperatures.
[00...
Embodiment 1
[0087] First, a copper core having a diameter of 0.75 mm was degreased (pretreatment) using a neutral degreasing solution 506 (manufactured by Ishihara Chemical Co., Ltd.). Specifically, after immersing the copper core in a neutral degreasing solution (at 35° C. for about 5 minutes), it was washed with pure water for about 3 minutes at room temperature, and then washed in running water for about 1 minute. Then, it was dipped in ethanol for about 2 minutes and dried.
[0088] Then, the temperature of the dispersion B was raised to about 30° C., and the copper core pretreated as above was immersed for about 2 minutes. By dipping, a dispersion liquid film-coated copper ball in which a film of the dispersion liquid was formed on the surface of the copper core was obtained.
[0089] After immersion, excess dispersion liquid adhering to the surface of the dispersion liquid film-coated copper balls was removed with a wiping paper.
[0090] Lead the copper ball into the above figu...
Embodiment 2
[0093] The silver-coated copper balls of Example 2 were produced in the same manner as in Example 1 above, except that copper balls with a diameter of 0.35 mm were used instead of copper balls with a diameter of 0.75 mm. The coating layer thickness of the silver ultrafine particles in the silver-coated copper ball of Example 2 was about 0.7 μm.
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