Heat-releasable pressure-sensitive adhesive sheet
An adhesive sheet, thermal peeling technology, applied in the direction of film/sheet-like adhesives, adhesives, synthetic resin layered products, etc., can solve the problems of inability to obtain adhesive force, insufficient followability of unevenness, blade breakage, etc. , to achieve excellent followability and adhesion, easy peeling and recycling of adherends, comfortable cutting and other processing effects
Active Publication Date: 2010-03-24
NITTO DENKO CORP
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AI Technical Summary
Problems solved by technology
When dicing such a semiconductor substrate having unevenness on the surface, there is a problem in the current heat-peelable adhesive sheet: due to insufficient followability to the unevenness, sufficient adhesive force cannot be obtained, and the During cutting, the chips peeled off by the adherend splash, and the yield decreases; the splashed chips collide with the cutting blade, and the blade is damaged
Method used
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Embodiment 1
[0056] (Rubber-like organic elastic layer)
[0057] 100 parts by weight of an acrylic copolymer (butyl acrylate: vinyl acrylate: acrylic acid = 100 parts by weight: 10 parts by weight: 5 parts by weight), 2 parts by weight of an isocyanate-based crosslinking agent (produced by Nippon Polyurethane Industry Co., Ltd.: trade name " CORONATEL"), 30 parts by weight of rosin phenolic resin (manufactured by SUMITOMO BAKELITE Co., Ltd.: trade name "SUMILITE RESIN") were mixed and dissolved in toluene to prepare a coating liquid. This coating solution was applied on a polyester film having a thickness of 50 μm so that the thickness after drying was 70 μm to form a rubbery organic elastic layer.
[0058] (thermally expandable adhesive layer)
[0059]100 parts by weight of an acrylic copolymer (butyl acrylate: vinyl acrylate: acrylic acid = 100 parts by weight: 10 parts by weight: 5 parts by weight), 5 parts by weight of an isocyanate-based crosslinking agent (produced by Japan Polyuret...
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Abstract
A heat-releasable pressure-sensitive adhesive sheet that excelling in rugged surface follow-up property, exhibits a satisfactory adhesive strength even when a bonding face of adherend is rough, and that in the use as a pressure-sensitive adhesive sheet for dicing of a semiconductor substrate with rough surface of sealing resin, etc., inhibits chip scattering, and that after the completion of working, can be easily stripped by heating with no stress imparted to the adherend. Further, there is disclosed a method of working an adherend, especially a process for manufacturing an electronic part, with the use of the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive sheet is a heat-releasable pressure-sensitive adhesive sheet having a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microglobules superimposed via a rubbery organic elastic layer on at least one major surface of a base material, characterized in that the rubbery organic elastic layer has a thickness of 1.5 to 42 times that of the thermally expandable pressure-sensitive adhesive layer.
Description
technical field [0001] The present invention relates to a heat-peelable adhesive sheet that has excellent adhesiveness and can be easily peeled from an adherend by heat treatment at any time, a method of producing electronic components using the adhesive sheet, and the like. Background technique [0002] As the adhesive sheet for semiconductor substrate processing used in the dicing process of the semiconductor substrate, etc., there is known a technique using a curable adhesive sheet in which ultraviolet rays and / or Alternatively, the adhesive is polymerized and cured by radiation to lower the adhesive force (see Patent Document 1). On the other hand, as an adhesive sheet for processing a semiconductor substrate, a technique of using a thermally peelable adhesive sheet in which the adhesive layer is composed of a thermally expandable adhesive layer containing thermally expandable microspheres, and the adhesive force is increased by heating has also been studied. Disappear ...
Claims
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IPC IPC(8): C09J7/02B32B25/04C09J201/00H01L21/301C09J7/29
CPCH01L2224/274C09J7/0296C08K7/22C09J2421/006C09J2205/11C09J2205/102H01L2924/09701H01L24/83C09J2201/162B32B25/04B32B7/10H01L2924/10253C09J2203/326C09D163/00H01L21/58H01L2224/83B32B5/022B32B7/12B32B15/06B32B25/042B32B25/06B32B25/08B32B25/10B32B25/12B32B25/14B32B27/283B32B27/30B32B27/34B32B27/36B32B27/40B32B2307/51B32B2457/00H01L2924/181C09J7/29Y10T428/24959C09J2301/162C09J2301/412C09J2301/408H01L2924/3512H01L2924/00
Inventor 有满幸生下川大辅
Owner NITTO DENKO CORP