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Substrate Handling System

A substrate processing system and substrate technology, applied in the manufacture of conveyor objects, electrical components, semiconductors/solid devices, etc., can solve problems such as increased solvent usage, difficult production tact, and longer time required for evaporation, etc., to achieve The effect of full-length dimensions

Active Publication Date: 2011-12-28
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In particular, when using a screen (halftone) exposure process in photolithography (photolithography), the film thickness of the resist is about 1.5 to 2 times the usual (about 1.5 μm) (approximately 2.0 to 3.0 μm), in this part of the resist coating process, since the amount of solvent used per substrate increases, the time required for the evaporation of the solvent in the reduced-pressure drying unit becomes longer, enabling production Tempo shortening becomes more difficult

Method used

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  • Substrate Handling System
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Experimental program
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no. 2 approach

[0115] image 3 Shown is the layout configuration of the coating and development processing system 100 according to the second embodiment of the present invention. In the drawings, parts having substantially the same configuration or function as those in the coating and development processing system 10 of the first embodiment described above are given the same reference numerals, and description thereof will be omitted. also, Figure 4 ~ Figure 6 Shown is the detailed arrangement or configuration of main parts in the coating and development processing system 100 .

[0116] In the system 100 of the second embodiment, the main difference from the system 10 of the above-mentioned first embodiment is that the first and second decompression drying units 102L, 102R arranged in the atrium space NS do not fix the substrate on the It is a decompression drying device of the advection method of the table method.

[0117] In the atrium space NS, in order to carry out substrate loading ...

no. 3 approach

[0146] Figure 8 Shown is the layout configuration of the coating and development processing system 170 according to the third embodiment of the present invention. In the figure, parts having substantially the same configuration or function as those in the coating and development processing system 10 of the first embodiment described above are given the same reference numerals and their descriptions are omitted. also, Figure 9 The structure of the resist coating unit (CT) 172 in this coating and development processing system 170 is shown.

[0147] In the system 170 of the third embodiment, the main difference from the system 10 of the above-mentioned first embodiment is that the resist coating unit (CT) 172 is not of the advection method in which the substrate is fixed on the stage. In the resist coating device, in the outbound production line A, the resist coating unit (CT) 172 is disposed adjacent to the output unit (OUT-PASS) 34 along the first outbound advection section...

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Abstract

PURPOSE: A processing system is provided to short a total length size by arranging a processing unit in a process flow order. CONSTITUTION: A processing system comprises a first process line, a second process line, a processing unit, and a first transfer system(22) of a third group. The first process line arranges the processing unit of the first group in a row through a transfer system unit. The second process line arranges the processing unit of the second group in a row through a transfer system unit. The second process line forms the first process line and an internal space. The processing unit of a third group is arranged in the internal space. The first transfer system carries the substrate from the processing unit into a substrate transfer unit.

Description

technical field [0001] The present invention relates to a substrate processing system having a transfer line for transferring a substrate to be processed in a substantially horizontal direction in the order of a process flow in a series of processing steps. Background technique [0002] Conventionally, in the resist coating and development processing system in the manufacture of FPD (Flat Panel Display), in order to cope with the increase in the size of the substrate to be processed, rollers or rollers and other transport bodies are laid in the horizontal direction. The advection transport path is equipped with an advection processing unit that transports the substrate in the horizontal direction and supplies predetermined liquid, gas, light, etc. to the surface of the substrate to be processed. A system structure or an array layout in which a plurality of processing units including such advective processing units are arranged in series is being standardized (for example, re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/26G03F7/16H01L21/677H01L21/00
CPCG03F7/16G03F7/30H01L21/67173
Inventor 梶原拓伸太田义治
Owner TOKYO ELECTRON LTD