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Shell structure for 3C (Computer, Communication and Consumer electronic) products

A shell and product technology, applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, etc., can solve the problems of volume reduction, high material cost, overall shell volume and weight increase, etc., to reduce thickness, reduce material costs, reduce The effect of overall volume and weight

Inactive Publication Date: 2010-06-23
HOCHENG CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, the plastic injection molded case is relatively cheap in terms of material cost, but in order to make the case have enough strength to withstand the pressure from the outside of the 3C product, the thickness of the NB case is about 2mm or more. In this way, the overall volume and weight of the shell will be relatively increased
[0004] The aluminum-magnesium alloy die-casting shell, though the characteristics of the metal alloy itself, can have a thickness of about 0.5mm or more to have sufficient strength to withstand the external pressure from the 3C product, so that it meets the requirements of volume reduction and weight reduction; but Due to the difficulty in making metal alloys and the high unit price, the unit cost of the metal alloy shell is relatively higher than that of the plastic molded shell, and a higher material cost must be paid

Method used

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  • Shell structure for 3C (Computer, Communication and Consumer electronic) products
  • Shell structure for 3C (Computer, Communication and Consumer electronic) products
  • Shell structure for 3C (Computer, Communication and Consumer electronic) products

Examples

Experimental program
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Embodiment Construction

[0016] see figure 1 , 2 As shown, it is a preferred embodiment of the shell structure 1 of the 3C product of the present invention, including a plastic molded part 2 and a support plate 3 .

[0017] The plastic molded part 2 is molded by plastic injection, and includes a rectangular panel 21 and sides 22 extending downwards from the sides of the panel 21 to serve as a top cover for a notebook computer and form an outer surface 23 and an inner surface 24 opposite to the outer surface 23 . In practice, the plastic molded part 2 can also be in other shapes, and can be used as a structural material for various 3C products such as computers, electronics and communications, so as to protect the electronic components inside the 3C products.

[0018] The support plate 3 is in the shape of a thin plate, and the support plate 3 can also be a flat thin plate with holes or unevenness, the thickness of the plate is between 0.08 ~ 0.5mm, the thickness W of the support plate 3 Thinner tha...

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Abstract

The invention provides a shell structure for 3C products, which comprises a plastic forming component and a supporting board. The plastic forming component can be formed into different shapes in an injection way and comprises an outer surface and an inner surface opposite to the outer surface. The supporting board is integrated with the inner surface of the plastic forming component, wherein the bending elasticity resistance rate of the supporting board is larger than that of the plastic forming component, the supporting board is thinner than the plastic forming component, and the thickness of the supporting board is between 0.08 mm and 0.5 mm, therefore, the thickness and the cost of the shell are reduced, and the sufficient bending resistance strength is generated to resist pressure from the outer surface of the plastic forming component.

Description

technical field [0001] The invention relates to a shell structure of a product, in particular to a shell structure of a 3C product, which combines a thin support plate with a high bending elastic rate on the inner surface of a plastic molded part to generate sufficient bending strength and resist Pressure from an external force on the surface of a plastic molding. Background technique [0002] At present, most of the computer, electronic and communication (3C) product shell structures on the market are made of plastic injection molding or aluminum-magnesium alloy die-casting to protect the electronic components in the 3C products, but the two shell structures have their own advantages. pros and cons. [0003] Among them, the plastic injection molded case is relatively cheap in terms of material cost, but in order to make the case have enough strength to withstand the pressure from the outside of the 3C product, the thickness of the NB case is about 2mm or more. In this way...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00
Inventor 李聪祥
Owner HOCHENG CORPORATION
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