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A method for preparing three-dimensional interpenetrating structure 3d-sic/al composite material

A technology of interpenetrating structure and composite materials, which is applied in the field of pressureless infiltration preparation of three-dimensional interpenetrating structure 3D-SiC/Al composite materials, can solve the problems of high cost and complicated process, and achieve improved wettability and reduced interface heat The effect of resistance and low expansion coefficient

Active Publication Date: 2018-03-23
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process has the disadvantages of complex process, high cost, and simple shape of formed parts.

Method used

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  • A method for preparing three-dimensional interpenetrating structure 3d-sic/al composite material
  • A method for preparing three-dimensional interpenetrating structure 3d-sic/al composite material
  • A method for preparing three-dimensional interpenetrating structure 3d-sic/al composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, the 3D-SiC / Al composite material is made by using SiC powder and aluminum alloy (Al-15Si-10Mg) as main raw materials, and using polycarbosilane as a binder and a sintering aid.

[0030] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0031] a. F220 (D50=47μm) SiC micropowder and poly The xylene solution of carbosilane (PCS) is mixed and stirred evenly, wherein the mass of PCS accounts for 8% of the sum of the mass of PCS and SiC micropowder, and silicon carbide powder coated with PCS can be obtained after the xylene volatilizes. Then press it into a SiC biscuit with a pressure of 260MPa on a ceramic tablet press;

[0032] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 700°C for 2 hours, and take samples after cooling to room temperature with the furnace;

[0033] c. Place the SiC b...

Embodiment 2

[0037] In this embodiment, the 3D-SiC / Al composite material is made of SiC powder and aluminum alloy (Al-15Si-10Mg) as the main raw materials, and polycarbosilane as the adhesive and sintering aid.

[0038] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0039] a. Mix and stir the pretreated F220 (D50=47 μm) SiC powder, F800 (D50=7.2 μm) SiC powder and polycarbosilane (PCS) xylene solution evenly, wherein the mass of PCS accounts for the mass of PCS and SiC powder and the percentage of 5%. SiC powder coated with PCS can be obtained after xylene volatilizes. Then press it into a SiC biscuit with a pressure of 200MPa on a ceramic tablet press;

[0040] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 1100°C for 1 hour, and take samples after cooling to room temperature with the furnace;

[0041] c. Place the ...

Embodiment 3

[0045] In this embodiment, the 3D-SiC / Al composite material is made by using SiC powder and aluminum alloy (Al-6Si-8Mg) as main raw materials, and using polycarbosilane as a binder and a sintering aid.

[0046] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0047] a. Mix and stir the pretreated F220 (D50=47 μm) SiC micropowder and polycarbosilane (PCS) xylene solution according to the designed ratio, wherein the mass of PCS accounts for 5% of the sum of the mass of PCS and SiC micropowder. After xylene volatilizes, silicon carbide powder coated with PCS micropowder can be obtained. Then press it into a SiC biscuit with a pressure of 220MPa on a ceramic tablet press;

[0048] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 600°C for 2 hours, and take samples after cooling to room temperature with the furnace...

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Abstract

The invention relates to a method for preparing a 3D-SiC / Al composite material with a three-dimensional interpenetrating structure, including the preparation of a 3D-SiC prefabricated part and the subsequent preparation of the 3D-SiC / Al composite material by pressureless infiltration. Among them, when the 3D-SiC preform is applied to the subsequent pressureless infiltration of the 3D-SiC / A composite material, it may or may not be pre-oxidized according to the composition of the aluminum alloy used. The SiC content in the composite material of the present invention is 50-73vol%, the density of the composite material can reach 2.90-3.1g / cm2, the thermal conductivity can reach 232W / (m·℃), and the thermal expansion coefficient can be as low as 5.72×10-6 / ℃ , the bending strength can reach 330MPa, and the comprehensive performance meets the technical performance requirements such as low expansion coefficient, high thermal conductivity and sufficient bending strength that electronic packaging materials must have.

Description

technical field [0001] The invention relates to a method for preparing a SiC / Al composite material, in particular to a method for preparing a pressureless infiltration of a three-dimensional interpenetrating structure 3D-SiC / Al composite material in which both SiC ceramics and aluminum alloys are continuous phases. Background technique [0002] SiC / Al composite materials can be tailored by changing the characteristics, content, distribution, etc. of the aluminum alloy phase and SiC ceramic phase to have tailorable thermophysical properties (such as thermal expansion properties, thermal conductivity) and mechanical properties (strength, etc.), so that It meets the dual-use needs of structure (support) and function (heat dissipation) of electronic packaging materials. Moreover, the SiC / Al composite material has good dimensional stability, high specific strength and specific elastic modulus, and the raw material price is less than 1 / 10 of the currently used high thermal conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D23/04C22C1/10C22C29/06C22F1/00
CPCC22C1/1015C22C1/1068C22C29/065C22F1/00B22D23/04C22C1/1021
Inventor 吴玉程汪冬梅汤文明郑治祥
Owner HEFEI UNIV OF TECH
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