System for processing substrates, convey system and method and mobile transverse chamber

A substrate processing device and mobile chamber technology, which is applied in the directions of transportation and packaging, conveyor objects, lighting and heating equipment, etc., can solve problems such as complex mechanical design, bottlenecks caused by the second film layer, and impact on production efficiency

Active Publication Date: 2010-07-07
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  • Claims
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Problems solved by technology

Therefore, such a system design is not conducive to updating and expanding
[0006] Second, the above-mentioned large fixed vacuum transfer chamber has a complex mechanical design and is not easily used for the transfer of large substrates
If after depositing a film layer with a short process time, a film layer that requires a long process time ...

Method used

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  • System for processing substrates, convey system and method and mobile transverse chamber
  • System for processing substrates, convey system and method and mobile transverse chamber
  • System for processing substrates, convey system and method and mobile transverse chamber

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Embodiment Construction

[0039] In general, embodiments described herein relate to systems and methods of processing boards, such as glass and other substrates for the solar or photovoltaic industries, and wafers for the semiconductor industry, but the invention is not limited thereto. More particularly, some embodiments described herein relate to systems and methods for processing substrates that include one or more mobile transverse chambers for transporting substrates between process modules and other stations, such as loading and unloading stations.

[0040] In some embodiments, a system for processing a substrate is provided, comprising: one or more mobile transverse chambers for moving between two or more process modules, and transporting one or more substrates to the two or more process modules at least one of the . Each mobile transverse chamber independently maintains a specific gas condition while moving between process modules and when one or more substrates are transported to the process m...

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Abstract

The invention provides a system for processing substrates, convey system and method and mobile transverse chamber. In accordance with some embodiments described herein, a system for processing substrates includes two or more process modules, a substrate handling robot, a load lock chamber, and a transverse substrate handler. The transverse substrate handler includes mobile transverse chambers configured to convey substrates to process modules, wherein each mobile transverse chamber is configured to maintain a specified gas condition during the conveyance of the substrates. The transverse substrate handler further includes a rail for supporting the mobile transverse chambers, wherein the rail is positioned adjacent to entry of the process modules, and drive systems for moving the mobile transverse chambers on the rail.

Description

technical field [0001] Embodiments described herein relate generally to a system and method for processing substrates such as but not limited to glass and other substrates used in the solar or photovoltaics (PV) industries, and Wafers used in the semiconductor industry. And the described embodiments of the present invention are particularly related to a system and method including one or more mobile transverse chambers for transferring substrates between process modules. Background technique [0002] The manufacture of semiconductor elements, flat display panels, and photovoltaic or solar cells requires multiple processes, such as etching, chemical vapor deposition (CVD), sputtering, and cleaning, on various substrates to produce predetermined device or product. These processes may each perform a single process step by a single and individual process tool or module. Since multiple process steps must be performed, the substrate must be transferred from one process tool to ...

Claims

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Application Information

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IPC IPC(8): B65G49/00B65G49/05B65G49/06B65G49/07H01L21/00H01L21/677H01L31/18
CPCH01L21/67727H01L21/67748H01L21/67742H01L21/6719H01L21/67754C23C16/54H01L21/67196C23C14/568H01L21/67736H01L21/67161
Inventor 雷仲礼麦华山刘弘苍朴乾兑朴相珣罗应聪吴子仲朱乐聪罗恩·罗斯申镇宇王晓明
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