IC (integrated circuit) assembly burn-in equipment and IC heating device used by same

Abstract

The invention provides IC (integrated circuit) assembly burn-in equipment and an IC heating device used by the same, wherein the IC heating device mainly comprises an upper cover plate, a fixing seat, a heating block and a base; the heating block is used for providing a heating surface close to uniformity so as to contact a measured IC; a heater and temperature inductor are accommodated in the heating block and electrically connected to a connector by utilizing a plurality of leads; the bottom of the connector is provided with a circuit board and a plurality of first connection points; an accommodating seat is arranged below the heating block for placing the measured IC; a part near the accommodating seat and corresponding to the circuit board is provided with a connecting seat; and the connecting seat is provided with a plurality of second connection points for correspondingly contacting and being conducted to the plurality of first connection points of the circuit board.

Description

technical field [0001] The present invention relates to a heating device, in particular to a burn-in device used in integrated circuit assembly (IC) burn-in test and the heating device used therein. Background technique [0002] After the packaged integrated circuit device (IC) is still required to conduct an electrical test at a preset high temperature to understand its stability, this procedure is usually called burn-in. During the burn-in procedure, it is necessary to heat and control the temperature of the IC under test, sensors, and other related components. This heating system has been widely implemented for many years. This system usually includes a heater, a temperature sensor, and a comparison measuring device. According to the difference between the voltage measured by the temperature sensor and a reference voltage, the difference is compared, and according to The difference between the two voltages is proportional to provide energy to a heater, and then the diffe...

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Problems solved by technology

[0003] However, the current connection structure between the IC heater and the test slot is generally a clamshell structure with a single pivot, and the IC heater is placed on the upper cover, and the heating rod and temperature sensor in the IC heater need to reuse wires connected to the test board

After long-term use, it is found that the upper cover with IC heater is easy to cause the insulation layer of the wire to wear and tear due to repeated switching, resulting in the exposed core of the wire inside the wire.

In addition, in the actual operation of the one-sided hinged cover structure, in order to facilitate the manual operation of the upper cover to detect the IC, a space for manual operation is deliberately left around the test board; however, this space is easy Air convection causes the heat source of the IC heater to change due to air convection, making the heating temperature of the IC unstable, resulting in unreliable test results, and even having to retest, resulting in time-consuming and expensive

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