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Manufacturing method of copper-clad plate and glue solution for copper-clad plate

A production method and technology of copper clad laminates, which are applied in the directions of adhesives, epoxy resin glue, printed circuit manufacturing, etc., can solve the problems of high rigidity, high cost, poor support performance, etc., and achieve convenient installation and connection, maintain heat resistance, low-cost effects

Active Publication Date: 2010-08-18
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, whether it is a rigid copper clad laminate or a flexible copper clad laminate, there are deficiencies. The main disadvantage of the former is that it is too rigid, which is not easy to install and connect with other electronic equipment. The disadvantage of the latter is that it is too flexible. The support performance is poor, and it is often necessary to install and weld with the help of reinforcing sheets (Stiffeners or Rigidisers) such as rigid copper-clad laminates, or use adhesives such as aluminum sheets, etc., to achieve installation by thermal bonding. In this way, in the original Higher cost further increases the cost
In fact, in many current terminal electronic consumer products, such as circuit boards used in digital cameras and MP3 / MP4, the flexibility requirement for the copper clad laminate only needs to be bent once. For this type of application, the existing Flexible circuit boards are not enough

Method used

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  • Manufacturing method of copper-clad plate and glue solution for copper-clad plate
  • Manufacturing method of copper-clad plate and glue solution for copper-clad plate
  • Manufacturing method of copper-clad plate and glue solution for copper-clad plate

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Experimental program
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Embodiment 1

[0019] This embodiment provides a glue solution for copper-clad laminates and a method for manufacturing copper-clad laminates. The glue solution is composed of the following components in parts by weight: 78 parts of nitrile rubber modified epoxy resin (SC-024, SHIN-AT&C, the content of nitrile rubber is 38wt%); brominated epoxy resin 117 parts 5 parts of dicyandiamide; 0.02 part of 2-methylimidazole; 20 parts of tetrabromobisphenol A, solvent (butanone, 30 parts).

[0020] The manufacturing method of the copper clad laminate includes the following steps:

[0021] (1) Preparation of glue solution: According to the above formula, add brominated epoxy resin, dicyandiamide, 2-methylimidazole and half of the solvent to the glue solution tank in sequence, and start high-speed stirring at the same time; then add nitrile rubber Modified epoxy resin, after addition, add the remaining solvent.

[0022] (2) Gluing: use glass fiber cloth as the base cloth, apply glue on the surface of...

Embodiment 2

[0025] The manufacturing method of the copper-clad laminate according to the present embodiment is basically the same as in the embodiment 1, but adopts the glue solution having the following composition: 50 parts of nitrile rubber modified epoxy resin (model SC-024, SHIN-A T&C, nitrile rubber 145 parts of brominated epoxy resin (GEBR400, Hongchang electronic material); 5 parts of dicyandiamide; 0.02 part of 2-methylimidazole; 20 parts of tetrabromobisphenol A; solvent (butanone, 20 parts ).

Embodiment 3

[0027] The manufacturing method of the copper-clad laminate according to the present embodiment is basically the same as that of Embodiment 1, but adopts a glue solution having the following composition: 95 parts of nitrile rubber modified epoxy resin (model SC-024, SHIN-A T&C, nitrile rubber 100 parts of brominated epoxy resin (GEBR400, Hongchang electronic material); 5 parts of dicyandiamide; 0.02 part of 2-methylimidazole; 25 parts of tetrabromobisphenol A; solvent (butanone, 25 parts ).

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Abstract

The invention relates to a manufacturing method of a copper-clad plate and glue solution for the copper-clad plate. The manufacturing method takes glass cloth as base cloth and successively comprises the steps of preparing glue solution, sizing base cloth and hot forming. The glue solution comprises 100 parts of epoxy resin, 10-40 parts of organic fire retardant, 1-30 parts of curing agent, 0.005-0.05 part of curing accelerator and 10-50 parts of dissolvent, wherein the epoxy resin is composed of 25-75 wt% of nitrile rubber modified epoxy resin and 25-75 wt% of bromination epoxy resin, and the content of nitrile rubber in the nitrile rubber epoxy resin is 30-60%. The invention provides a 'semi-soft plate' with medium elasticity bending modulus. The semi-soft plate has certain flexibility, has the supporting performance provided by a rigid copper-clad plate, is especially suitable for electronic connection devices without very high flexibility requirements and has the advantages of low manufacturing cost and convenient installation and connection.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-clad laminates for printed circuit boards, and in particular relates to a method for manufacturing copper-clad laminates and glue for copper-clad laminates. Background technique [0002] Today's society is booming in the direction of electronics, and electronic products have filled our world. With the development of technology and the diversification of application places, various high-tech devices such as mobile phones, cameras, printers, etc. are becoming thinner and smaller. In the direction of development, the printed circuit board (PCB), its key electronic component, is also developing towards thinner and multi-level, which puts forward higher performance requirements for the copper clad laminate as the PCB substrate. [0003] In the prior art, according to mechanical rigidity, copper clad laminates can be divided into rigid copper clad laminates (CCL) and flexible copper clad l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/03C09J163/00
Inventor 彭代信邹水平
Owner VENTEC ELECTRONICS SUZHOU
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