Manufacturing method of copper-clad plate and glue solution for copper-clad plate

Abstract

The invention relates to a manufacturing method of a copper-clad plate and glue solution for the copper-clad plate. The manufacturing method takes glass cloth as base cloth and successively comprises the steps of preparing glue solution, sizing base cloth and hot forming. The glue solution comprises 100 parts of epoxy resin, 10-40 parts of organic fire retardant, 1-30 parts of curing agent, 0.005-0.05 part of curing accelerator and 10-50 parts of dissolvent, wherein the epoxy resin is composed of 25-75 wt% of nitrile rubber modified epoxy resin and 25-75 wt% of bromination epoxy resin, and the content of nitrile rubber in the nitrile rubber epoxy resin is 30-60%. The invention provides a 'semi-soft plate' with medium elasticity bending modulus. The semi-soft plate has certain flexibility, has the supporting performance provided by a rigid copper-clad plate, is especially suitable for electronic connection devices without very high flexibility requirements and has the advantages of low manufacturing cost and convenient installation and connection.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-clad laminates for printed circuit boards, and in particular relates to a method for manufacturing copper-clad laminates and glue for copper-clad laminates. Background technique [0002] Today's society is booming in the direction of electronics, and electronic products have filled our world. With the development of technology and the diversification of application places, various high-tech devices such as mobile phones, cameras, printers, etc. are becoming thinner and smaller. In the direction of development, the printed circuit board (PCB), its key electronic component, is also developing towards thinner and multi-level, which puts forward higher performance requirements for the copper clad laminate as the PCB substrate. [0003] In the prior art, according to mechanical rigidity, copper clad laminates can be divided into rigid copper clad laminates (CCL) and flexible copper clad l...

AI Technical Summary

Problems solved by technology

In addition, whether it is a rigid copper clad laminate or a flexible copper clad laminate, there are deficiencies. The main disadvantage of the former is that it is too rigid, which is not easy to install and connect with other electronic equipment. The disadvantage of the latter is that it is too flexible. The support performance is poor, and it is often necessary to install and weld with the help of reinforcing sheets (Stiffeners or Rigidisers) such as rigid copper-clad laminates, or use adhesives such as aluminum sheets, etc., to achieve installation by thermal bonding. In this way, in the original Higher cost further increases the cost

In fact, in many current terminal electronic consumer products, such as circuit boards used in digital cameras and MP3 / MP4, the flexibility requirement for the copper clad laminate only needs to be bent once. For this type of application, the existing Flexible circuit boards are not enough

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