Low-stress bottom filling method of laminating device

Abstract

The invention discloses a low-stress bottom filling method of a laminating device, which comprises the following steps of: selecting epoxy glue; (2) removing air bubbles generated when the epoxy glue is mixed; (3) applying the glue on the laminating device; (4) curing the epoxy glue in two stages: (a) hardening and molding the epoxy glue; (b) strengthening and curing the epoxy glue; and (5) detecting whether the epoxy glue is completely cured. The method enables the layers of the laminating device to have higher bonding force and mechanical strength; and the glue layer can not generate process residual stress. The method is widely applied to packaging multichips in a laminating way, inverse welding interconnection devices, a micro-electro-mechanical system (MEMS) device, a liquid crystal box, and the like, reduces the curing residual stress for filling the epoxy glue of the laminating device, ensures the mechanical strength and reduces the damage probably caused by stress to the minimum, thereby improving the thermodynamic reliability of the laminating device.

Description

technical field [0001] The invention relates to a filling method, in particular to a method for filling the bottom of a laminated device for reducing the residual stress in the curing process of the laminated device when filling epoxy glue. Background technique [0002] A notable feature of the modern microelectronics industry is that it requires the smallest volume while maintaining various optoelectronic functions. In order to achieve this goal, it is necessary to adopt a compact package. One way of this package is to combine chips and materials with different functions in a laminated form. While realizing electrical connection, it is necessary to ensure mechanical strength and thermodynamic reliability. , so epoxy glue is used to fill between the layers. After the epoxy glue is cured, there is a certain mechanical strength between the layers, and it can alleviate the thermal mismatch stress between the layers and improve the thermodynamic reliability. The underfill metho...

AI Technical Summary

Problems solved by technology

For example, for memory chips, the current 16-layer chip stack packaging has been realized, and the chip needs to be thinned to 20 μm to 30 μm; Thinning to about 10μm; at this time, the device is more sensitive to stress, causing the chip to warp, or even cracked when damaged, and the curing stress of the epoxy glue between layers is undesirable.