Method and device for realizing photoelectrochemical micro-etch processing of masked electrode

Abstract

The invention provides a method and a device for realizing the photoelectrochemical micro-etch processing of a masked electrode, and relates to the micro processing field in the manufacturing technology. A masked electrode used by the invention comprises a glass substrate, an indium tin oxide (ITO) layer and a photoresist mask layer, wherein the conductive light-permeable ITO layer is used as a tool electrode for electrochemical processing and can be permeated by a laser beam, and the photoresist mask layer can limit the action zones of the laser beam and the electrochemical electrode to achieve the double effects of a beam mask and an electric field mask. When the laser beam permeates the masked electrode, a mask pattern is imaged on the surface of a workpiece, the force effect of a shock wave generated by the irradiation of the laser between the workpiece and the electrolyte enables the passivation layer to be removed by the generation of stress corrosion. Meanwhile, the workpiece material at the laser-irradiated part is removed by etching under the action of the photoelectrochemical reaction. The invention can effectively enhance the processing efficiency, the micro processing degree and the processing precision of the complex pattern, and is applicable to the micro processing of the conductive metal material.

Description

Technical field [0001] The invention relates to the field of micro-processing in manufacturing technology, in particular to a photoelectrochemical micro-etching processing method and device of a mask electrode, which is suitable for processing the micro-structure of conductive metal materials. Background technique [0002] With the continuous emergence of high-tech products, the requirements for the function, structural complexity, and reliability of micro devices are getting higher and higher, making the feature sizes from micrometers to millimeters, the use of high-performance materials, and certain shape accuracy and The demand for precision small parts with surface quality requirements is increasingly urgent. After years of hard work and exploration, the processing and manufacturing technology of micro-devices has been greatly developed and has been extended to various modern processing methods. Among them, the laser has the characteristics of high energy, high spatial resol...

AI Technical Summary

Problems solved by technology

The manufacturing precision of the microprobe electrode in this method will definitely affect the processing of the substrate, and the achieved processing fineness is restricted by the probe electrode; It can irradiate the gap of the array electrode that does not need to be processed, but cannot directly irradiate the processed part of the substrate facing the electrode

Images