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Glass substrate and cutting method thereof

A glass substrate and cutting method technology, applied in glass cutting devices, glass manufacturing equipment, optics, etc., can solve the problems of occupying design space, unable to meet the maximization of edge benefits, and high unit product cost, reducing the space occupied and improving The effect of cutting efficiency and improving utilization

Inactive Publication Date: 2010-09-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art glass substrate design, the alignment marks set up for cutting and other process needs occupy a large amount of design space, which cannot meet the maximization of edge benefits, and the cost per unit product is high

Method used

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  • Glass substrate and cutting method thereof
  • Glass substrate and cutting method thereof
  • Glass substrate and cutting method thereof

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Embodiment Construction

[0030] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0031] In the process of designing and manufacturing glass substrates, it is necessary to pursue a higher utilization rate. In the present invention, by adopting the technical scheme shared by process marks such as alignment marks and cutting marks, the design space occupied by process marks is effectively reduced. In addition, the present invention Corresponding cutting methods are also provided.

[0032] In the technical scheme of the present invention, the process marks are shared. One aspect is to share two sets of alignment marks between adjacent liquid crystal panels in the traditional design as a set of alignment marks. The panel is shared. When cutting and maintaining the liquid crystal panels on both sides of the set of alignment marks, the above-mentioned set of shared alignment marks can be used. In this em...

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PUM

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Abstract

The invention provides a glass substrate and a cutting method thereof, wherein the glass substrate comprises more than one liquid crystal panel and process marks, the process mark positioned between every two liquid crystal panels on a grid line and / or data line direction is in common. The embodiment of the invention also discloses a cutting method of the glass substrate, which comprises the steps of: cutting the glass substrate by a cutting tool bit according to cutting position information determined by the process mark shared between every two liquid crystal panels on the grid line and / or data line direction; moving the cutting tool bit to a secondary cutting position after arriving at a destination point; and carrying out secondary cutting on the glass substrate by the cutting tool bit. The glass substrata and the cutting method thereof can meet the maximization of edge benefit, lower the cost of unit product, and can improve the efficiency of cutting the glass substrate.

Description

technical field [0001] The invention relates to the technical field of liquid crystal manufacturing, in particular to a glass substrate and a cutting method for the glass substrate. Background technique [0002] In the manufacturing process of liquid crystal displays, it is usually necessary to set process marks such as alignment marks and cutting marks on the glass substrate, and when cutting the glass substrate, the cutting position can be determined according to the alignment marks, and the cutting quality can be determined according to the cutting marks. To realize alignment and cutting of glass substrates, the size of the above-mentioned process marks is designed in the product development and design stage according to the capabilities of each process equipment and the requirements of equipment parameters. [0003] figure 1 It is a structural schematic diagram of a glass substrate in the prior art, such as figure 1 As shown, each panel (panel) on the glass substrate h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02G02F1/1333
Inventor 刘家安高翔张莹
Owner BOE TECH GRP CO LTD
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