Manufacturing process for plugging conductive holes of circuit board with resin

Abstract

The invention discloses a manufacturing process for plugging conductive holes of a circuit board with resin, which comprises the following steps: A) carrying out plated through hole and electroplating treatment on a circuit board substrate which is provided with conductive holes; B) carrying out windowing treatment on conductive holes of the circuit board substrate which is electroplated, and adhering a dry film to transfer the printed picture; C) electroplating the conductive holes of the circuit board which is provided with the dry film; D) filling resin into the conductive holes so as to plug the conductive holes, and baking the circuit board at low temperature after the conductive holes are plugged; E) removing the remained resin through polishing way; F) removing the film of the circuit board after being polished; and G) and baking the circuit board at high temperature after the film is removed. The process not only can solve the problem that the air bubbles are easy to produce by directly filling ink or other anti-corrosion materials, but also greatly reduces the polishing difficulty; and during the hole plugging process of the conductive holes of the circuit board, the circuit board is only required to be polished for one time, so not only the efficiency is improved, but also the cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit board (PCB) manufacturing technology, and in particular relates to the manufacturing technology of the circuit board in which conductive holes need to be filled in double-layer or multi-layer circuit boards. Background technique [0002] With the current development of electronic technology, the manufacturing process of printed circuit boards, which are almost indispensable in electronic products, has also been greatly developed, from single-layer boards to double-layer boards, until now the most commonly used multi-layer boards. When manufacturing double-layer boards, especially multi-layer boards, it is necessary to isolate the metal layer to connect the printed circuits of each layer, so it is necessary to design corresponding conductive holes in the metal base layer. The conductive hole must be filled, otherwise, during the subsequent processing of the circuit board, especially during wave sol...

AI Technical Summary

Problems solved by technology

But in the filling process, it is difficult to effectively overcome the problem of air bubbles; and when grinding the excess filling material, it needs to be polished repeatedly, and it is difficult to polish it clean

Images