Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate

A technology for encapsulating substrates and sintering metal, which is applied in the cutting tools of sawing machines, metal sawing equipment, metal processing equipment, etc., can solve the problems of insufficient online cutting length, reduce production costs, weak diamond holding force, etc., and achieve high processing efficiency. , long service life, good wear resistance

Active Publication Date: 2010-10-27
XIAN DIASH SUPERHARD MATERIALS DEV
View PDF3 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of blade is determined by its properties. When cutting, its radial wear is less than that of the side, and it is easy to form a convex edge shape, so that the actual cutting saw blade becomes relatively thin, which will cause chip shape deformation and problems such as insufficient service life
At present, the division of QFN packaged devices is almost all performed by resin-based diamond saw blades. Due to the characteristics of vertical consumption, the quality of online cutting is excellent, which not only ensures the size and structure of the chip, but also controls the occurrence of ex

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example 1

[0016] Sintered metal-based diamond saw blade based on saw cutting of QFN package substrate, including diamond abrasive grains and metal matrix. The volume percentage concentration of diamond abrasive grains is 55%, the particle size is 38μm, and the metal matrix consists of 98 parts by weight of metal powder. And 2 parts by weight of inorganic fillers. The metal powder that composes the metal carcass includes 74 parts by weight of Cu, 17 parts by weight of Sn, and 7 parts by weight of Co. The filler includes 1 part by weight of SiC and 1 part by weight of Al 2 O 3 , SiC and Al 2 O 3 The particle size is 5μm.

[0017] The matrix composition of the Cu-based diamond saw blade is prepared according to the above composition design, and then the metal powders of the matrix material are mixed with inorganic fillers and then mixed with diamond abrasive grains. The metal matrix is ​​prepared by hot pressing and sintering after cold pressing. The rough diamond saw blade ...

Example Embodiment

[0018] Example 2

[0019] Sintered metal-based diamond saw blade based on saw cutting of QFN package substrate, including diamond abrasive grains and metal matrix. The volume percentage concentration of diamond abrasive grains is 60%, the particle size is 45μm, and the metal matrix consists of 97 parts by weight of metal powder. And 3 parts by weight of inorganic fillers, the metal powder composing the metal carcass includes 80 parts by weight of Cu, 10 parts by weight of Sn, and 7 parts by weight of Co. The particle size of the above-mentioned simple metal powders is 38μm, and the inorganic The filler includes 1 part by weight of SiC and 2 parts by weight of Al 2 O 3 , SiC and Al 2 O 3 The particle size is 6μm.

[0020] The matrix composition of the Cu-based diamond saw blade is prepared according to the above composition design, and then the metal powders of the matrix material are mixed with inorganic fillers and then mixed with diamond abrasive grains. The metal matrix is ​​pre...

Example Embodiment

[0021] Example 3

[0022] Sintered metal-based diamond saw blade based on saw cutting of QFN package substrate, including diamond abrasive grains and metal matrix. The volume percentage of diamond abrasive grains is 65%, the particle size is 45μm, and the metal matrix consists of 96 parts by weight of metal powder. And 4 parts by weight of inorganic filler, the metal powder composing the metal matrix includes 45 parts by weight of CuSn 20 Pre-alloyed powder, 37 parts by weight of Cu, 6 parts by weight of Sn and 8 parts by weight of Co. The particle size of the above-mentioned simple metal powders are all 38μm, CuSn 20 The particle size of the pre-alloyed powder is 45μm, and the inorganic filler constituting the metal matrix includes 2 parts by weight of SiC and 2 parts by weight of Al 2 O 3 , SiC and Al 2 O 3 The particle size is 7μm.

[0023] The matrix composition of the Cu-based diamond saw blade is prepared according to the above composition design, and then the metal powders of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Granularityaaaaaaaaaa
Granularityaaaaaaaaaa
Granularityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a saw-type sintering metal base diamond saw blade for cutting a QFN (Quad Flat Non-leaded) package substrate, which comprises diamond abrasive particles and metal matrix. The metal matrix comprises metal powder and inorganic filler, wherein the metal powder consists of Cu powder, or CuSn20 prealloying powder, Sn powder and Co powder, and the inorganic filler consists of SiC and Al2O3; two series of metal matrix which take Cu and Co as bases are formed according to high-content elements. The qualified metal base diamond saw blade is prepared by the following steps of: firstly, preparing the components of the matrix of the metal base diamond saw blade; and then evenly mixing all the metal powders and the inorganic filler, and then mixing with the diamond abrasive particles; carrying out cold-pressed performing, and then carrying hot-pressed sintering to prepare a metal base diamond saw blade blank; and finally carrying out precision finishing, such as internal and external circle cutting, thickness reducing and the like. The saw-type sintering metal base diamond saw blade has the advantages of high strength and good abrasion resistance, and has the characteristics of high processing efficiency and long service life on the premise of satisfying the quality requirement of on-line chip cutting.

Description

technical field [0001] The invention relates to the field of metal-diamond hybrid composite material products and tools, in particular to a sintered metal-based diamond saw blade for saw-cutting QFN packaging substrates. Background technique [0002] The singulation and segmentation of IC chips is an important process that has been insurmountable in the semiconductor packaging industry so far. In the entire QFN (Quad Flat No-lead) packaging process, chip dicing is the end process of the packaging process. Once a problem occurs in this process, it may cause a series of processes including front-end manufacturing and back-end packaging. If the implementation goes to waste, the subsequent performance test and terminal application will also come to naught. It can be seen that chip segmentation and processing play a central role in linking the past and the future in the entire QFN device manufacturing industry chain. [0003] With the continuous acceleration of the miniaturizati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23D61/00B22F3/16
Inventor 南俊马徐可为张敬朝
Owner XIAN DIASH SUPERHARD MATERIALS DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap