Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate

Abstract

The invention discloses a saw-type sintering metal base diamond saw blade for cutting a QFN (Quad Flat Non-leaded) package substrate, which comprises diamond abrasive particles and metal matrix. The metal matrix comprises metal powder and inorganic filler, wherein the metal powder consists of Cu powder, or CuSn20 prealloying powder, Sn powder and Co powder, and the inorganic filler consists of SiC and Al2O3; two series of metal matrix which take Cu and Co as bases are formed according to high-content elements. The qualified metal base diamond saw blade is prepared by the following steps of: firstly, preparing the components of the matrix of the metal base diamond saw blade; and then evenly mixing all the metal powders and the inorganic filler, and then mixing with the diamond abrasive particles; carrying out cold-pressed performing, and then carrying hot-pressed sintering to prepare a metal base diamond saw blade blank; and finally carrying out precision finishing, such as internal and external circle cutting, thickness reducing and the like. The saw-type sintering metal base diamond saw blade has the advantages of high strength and good abrasion resistance, and has the characteristics of high processing efficiency and long service life on the premise of satisfying the quality requirement of on-line chip cutting.

Description

technical field [0001] The invention relates to the field of metal-diamond hybrid composite material products and tools, in particular to a sintered metal-based diamond saw blade for saw-cutting QFN packaging substrates. Background technique [0002] The singulation and segmentation of IC chips is an important process that has been insurmountable in the semiconductor packaging industry so far. In the entire QFN (Quad Flat No-lead) packaging process, chip dicing is the end process of the packaging process. Once a problem occurs in this process, it may cause a series of processes including front-end manufacturing and back-end packaging. If the implementation goes to waste, the subsequent performance test and terminal application will also come to naught. It can be seen that chip segmentation and processing play a central role in linking the past and the future in the entire QFN device manufacturing industry chain. [0003] With the continuous acceleration of the miniaturizati...

AI Technical Summary

Problems solved by technology

This type of blade is determined by its properties. When cutting, its radial wear is less than that of the side, and it is easy to form a convex edge shape, so that the actual cutting saw blade becomes relatively thin, which will cause chip shape deformation and problems such as insufficient service life

At present, the division of QFN packaged devices is almost all performed by resin-based diamond saw blades. Due to the characteristics of vertical consumption, the quality of online cutting is excellent, which not only ensures the size and structure of the chip, but also controls the occurrence of excessive burrs, but it is limited to the composition of the carcass. Due to the characteristics of the material, the holding force of the resin-based saw blade on the diamond is weak, and the carcass material is easily worn and consumed, resulting in a serious shortage of online cutting length, ranging from up to a thousand meters to less than half, which does not help to reduce production costs , in addition, due to the low strength of the resin-based carcass, the saw blade is prone to breakage when the workpiece feed rate is increased, which seriously restricts the improvement of cutting efficiency