Method for collecting water in the air by utilizing solar semiconductor refrigeration technique

A semiconductor and solar technology, applied in the field of water collection, can solve the problem of lack of groundwater and achieve the effect of simple equipment

Inactive Publication Date: 2010-10-27
李松
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, limited by geological conditions, some arid areas have no groundwater for exploitation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for collecting water in the air by utilizing solar semiconductor refrigeration technique

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Please refer to the attached figure 1 Shown, the present invention is further described.

[0029] As shown in the pattern,

[0030] When sunlight shines on the solar battery panel 1, the solar battery panel 1 charges the battery 3, and the solar battery panel controller 2 controls the charging current to protect the battery 3 from charging. In this example, the solar panel is 40W.

[0031] When the electric quantity in the storage battery 3 reaches the requirement. The semiconductor refrigeration sheet 5 is powered by the solar panel controller 2, and the solar panel controller 2 will control the current.

[0032] Under the action of electric current, the semiconductor refrigeration sheet 5 cools down rapidly at its cold end, and the temperature at the hot end increases accordingly. In this example, the semiconductor cooling chip is 33.4w, 30mmX30mmX3.2mm. Heat dissipation aluminum sheet 4 can be bonded on the hot end of semiconductor refrigeration sheet 5 with hea...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a method for collecting water from the air. According to the principle that water vapour dissolution in the air is changed along with temperature, electric energy produced by solar-cell panel is utilized to supply power to a semiconductor refrigerating piece, the temperature of the cold end of the refrigerating piece is reduced under the action of current, when the temperature of a cold storage plate connected with the cold end is lower than the dew-point temperature of the environment, the water in the air is dewed on the cold storage plate.

Description

technical field [0001] The present invention relates to a method of collecting water from the air. Background technique [0002] The climate is warming, precipitation is decreasing, arid and semi-arid areas are expanding, and desertification is becoming more and more serious. Drought threatens people's survival and affects a variety of industries. [0003] At present, in response to drought, people usually exploit groundwater. However, with the development of society and the change of climate, the groundwater level keeps dropping. Moreover, limited by geological conditions, some arid areas have no groundwater for extraction. People need to find a permanent source of water. [0004] The air surrounds the whole earth, and the air on the earth is circular; the air contains moisture, and the amount of water vapor dissolved in the air changes with the temperature. One cubic meter of air can dissolve 9.41 grams of water at 10°C, and at 30°C Dissolve 30.38 grams of water. Und...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): E03B3/28
Inventor 李松
Owner 李松
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap