Electronic label package and manufacturing method thereof

Abstract

The invention relates to an electronic label package comprising an electronic label wafer, a package pin and a substrate for placing the electronic label wafer and the package pin. The package pin is electrically connected with the electronic label wafer; besides, the electronic label wafer, the package pin, leads and the substrate are packaged in a package filling body together. The invention also provides a manufacturing method of the electronic label package, comprising the following steps of: manufacturing a wafer, and manufacturing a plurality of electronic label wafers in matrix arrangement on the wafer; cutting the wafer to obtain the separate electronic label wafer; picking up the electronic label wafer and directly placing the electronic label wafer on the substrate; manufacturing the package pin and placing the package pin on the substrate; electrically connecting the package pin with the electronic label wafer; and encapsulating the electronic label wafer, the substrate and the package pin with the package filling body.

Description

technical field [0001] The invention relates to an electronic label package, and at the same time relates to a manufacturing method of the electronic label package. Background technique [0002] Electronic tags, also known as RFID (Radio Frequency Identification) radio frequency identification, is a non-contact automatic identification technology. Through the radio waves emitted by sensors within a distance of several centimeters to several meters, the information stored in the electronic tag can be read to identify the identity of the items, people and appliances represented by the electronic tag. Like other commonly used AIDs such as barcodes and magnetic stripes, RFID is an AID technology. Each target object corresponds to a unique electronic identification code (UID) in the radio frequency card reader, which is attached to the object to identify the target object, such as a carton, pallet or packing box. The radio frequency card reader (transponder) reads the identific...

AI Technical Summary

Problems solved by technology

Through this packaging method, the electronic tag chip is exposed in the air. If this electronic tag and objects, such as cartons, pallets or packing boxes, go through the production process of hundreds of degrees Celsius and dozens of atmospheric pressures together, The damage rate of electronic tags is almost 100%, and the purposes of identification, management, tracking and tracing cannot be achieved at all

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