Mems device and method of fabricating the same

A technology of micro-electromechanical systems and devices, which is applied to the components of TV systems, piezoelectric/electrostrictive/magnetostrictive devices, generators/motors, etc., can solve the problem of compatibility with IC processing and temperature tolerance Low, residual chemical gas overflow and other issues, to achieve the effect of strong mechanical and physical support
CN101898745AActive Publication Date: 2010-12-01XIAN YISHEN OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAN YISHEN OPTOELECTRONICS TECH CO LTD
Publication Date
2010-12-01

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Abstract

The present invention relates to a micro electrical-mechanical system (MEMS) device and a method of fabricating the same, wherein the device comprises a suspended thin film microstructure (200) arranged above a substrate (100), and is characterized in that the suspended thin film microstructure (200) includes an anchoring portion (250) adhered to the top surface (106) of the substrate (100); a suspended portion (260) arranged above the top surface (106) of the substrate (100) and having a base plane (205) configured in parallel to the substrate (100), and a base clearance is arranged between the base plane (205) and the top surface (106) of the substrate (100); the suspended portion (260) further includes a first recess portion (210) spaced at a first vertical clearance (151) with the top surface (106) of the substrate (100), the first vertical clearance (151) being configured differentially smaller than the base clearance (150). The invention is capable of providing strong mechanical and physical support force for sediment and lithographic patterns of a suspended construction unit.
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Description

technical field

[0001] The invention relates to a Micro-Electro-Mechanical System (Micro-Electro-Mechanical System, MEMS for short) device and a manufacturing method thereof. Background technique

[0002] MEMS include integrated micro-devices, such as mechanical, optical and thermal sensing components, formed on a substrate, which is a single or composite layer of solid-state material. MEMS can be fabricated using existing wafer batch processing techniques to form the aforementioned microscopic devices, ranging in size from nanometers to millimeters, on solid-state substrates such as silicon wafers. These MEMS devices are used for sensing control at the microscale and perform various mechanical, optical, or chemical functions, either as a stand-alone single unit or in arrays that synergize within the microscale to produce an overall effect. Such MEMS devices can be applied but not limited to: accelerometers, gyroscopes, pressure sensors, chemical and flow sensors, micro-opt...

Claims

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