The utility model provides an eight-layer high-frequency circuit board. The laminated board sequentially comprises a first
solder mask layer, a first
copper layer, a first prepreg layer, a second
copper layer, a first core board layer, a third
copper layer, a second prepreg layer, a fourth copper layer, a middle layer, a fifth copper layer, a third prepreg layer, a sixth copper layer, a second core board layer, a seventh copper layer, a fourth prepreg layer, an eighth copper layer and a second
solder mask layer from top to bottom, the middle layer comprises a third core plate, a heat dissipation
ceramic frame and a fourth core plate, a hollow cavity is formed in the position, close to a
high heat area of the circuit board, of the heat dissipation
ceramic frame, a first aluminum-based heat dissipation sheet is embedded and fixed in the hollow cavity, and the upper surface of the first aluminum-based heat dissipation sheet is in contact with the third core plate in an attached mode; the lower surface of the first aluminum-based radiating fin is attached to and contacted with the fourth core plate; a plurality of embedding grooves are formed in the side face, corresponding to the first aluminum-based cooling fins, of the first core plate layer, and second aluminum-based cooling fins are arranged in the embedding grooves in an embedded mode. And the overall heat dissipation efficiency of the circuit board is improved.