Method and equipment for processing die-cut tag

Abstract

The invention relates to a method and equipment for processing a die-cut tag. The method comprises the following processing steps of: feeding a raw material of which the bottom layer is bonded with a conductive layer material into a die-cutting machine to obtain a front side conductive layer circuit structure and a back side conductive layer circuit structure by die cutting; stripping conductive layer material waste on the raw material from the bottom layer by a stripping mechanism and winding usable raw material; coating hot melt adhesive on the conductive layer material of the raw material;correctly folding the raw material along a middle boundary by a folding mechanism and conveying the folded raw material to a hot-pressing mechanism; performing hot-pressing combination on the front side conductive layer circuit structure and the back side conductive layer circuit structure on the raw material coated with the hot melt adhesive by the hot-pressing mechanism and conveying the raw material after hot-pressing combination to a winding mechanism; and winding an electronic tag raw material formed by hot pressing by the winding mechanism. The method is mainly used in mass production of substrate-free electronic tags and requires improving production efficiency and ensuring product quality in a production process.

Description

technical field [0001] The invention relates to a processing method and equipment for a substrate-less electronic soft label, in particular to a processing method and equipment for a die-cut label. Background technique [0002] With the development of electronic technology, electronic tags with security and anti-counterfeiting functions have gradually entered our lives. They also have the advantages of high sensitivity, small size, and low cost. [0003] For example, the Chinese invention patent specification (authorized announcement number: CN100423026C) discloses a high-precision radio frequency soft label. The base layer of the label is composed of an insulating film layer and conductive layers attached to the front and back of the insulating film layer respectively. The conductive layer has a decoding circuit composed of capacitors, wires and decoding points. The periphery of the coil is characterized in that: the width of the capacitor wire and the coil wire gradually ...

AI Technical Summary

Problems solved by technology

However, the existing electronic tags do have the following disadvantages: (1) the existing electronic tags all require substrate materials (insulating film layers), which increases the thickness of the product

(2) The existing electronic tags all require substrate materials (insulating film layers), which increases the production cost of the product

(3) The existing electronic tags all need substrate material (insulating film layer), which causes the design and processing of its decoding point (or connection point) and the design and processing of capacitors to take the factors of the insulating film layer into consideration , otherwise the performance of the label (such as: sensitivity) will be difficult to guarantee

[0005] At present, the above-mentioned substrateless electronic tags have structurally made up for the defects of the substrate tags with insulating films. None mentioned in the technology

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