Easily recovered electroplated diamond grinding wheel

An electroplating diamond, easy-to-recycle technology, used in bonded grinding wheels, metal processing equipment, abrasives, etc., can solve the problems of troublesome recycling, loss of cutting ability, complicated process, etc., and achieve convenient and easy recycling, rapid disassembly, and efficient disassembly. Effect

Inactive Publication Date: 2011-01-05
NINGBO UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the electroplated diamond grinding wheel is used many times, the diamond abrasive grains in the abrasive layer are worn away and the abrasive layer becomes thinner, and the electroplated diamond grinding wheel with remaining diamond abrasive grains loses its cutting ability and is scrapped. However, because diamond abrasive grains are relatively expensive, and The manufacture of the grinding wheel substrate also consumes material and costs, so it is often necessary to recycle the end-of-life electroplated diamond grinding wheel
The main problem of recycling the scrapped electroplated diamond grinding wheel is to separate the abrasive layer from the substrate. However, for the current electroplated diamond grinding wheel, the process of separating the abrasive layer from the substrate is relatively complicated and the efficiency is relatively low. kind of hard

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: As shown in the figure, a kind of easily recyclable electroplated diamond grinding wheel comprises a base body 1, an auxiliary base body 2 and a diamond abrasive layer 3, and the material of the base body 1 and the auxiliary base body 2 is low carbon steel, and the base body 1 is integrally provided with Cylindrical connecting part 11, the diameter of connecting part 11 is 15.02 mm, and the connection between connecting part 11 and base body 1 is integrally provided with stepped shaft 12, and the outer diameter of stepped shaft 12 is smaller than that of auxiliary base body 2 and larger than that of connecting part 11. Diameter, the outer diameter of the auxiliary base 2 is 20mm, the auxiliary base 2 is provided with an inner hole, the diameter of the inner hole is 15mm, the auxiliary base 2 is interference-fitted on the connecting part 11, and the length of the connecting part 11 is longer than the auxiliary base The length of 2 is less than 0.5mm, and the...

Embodiment 2

[0014] Embodiment 2: An electroplated diamond grinding wheel that is easy to recycle includes a base body 1, an auxiliary base body 2 and a diamond abrasive layer 3. The materials of the base body 1 and the auxiliary base body 2 are medium carbon steel, and the base body 1 is integrally provided with a cylindrical connecting portion 11. The diameter of the connection part 11 is 111.65 mm. The connection between the connection part 11 and the base body 1 is integrally provided with a stepped shaft 12. The outer diameter of the stepped shaft 12 is smaller than that of the auxiliary base body 2 and larger than the diameter of the connection part 11. The auxiliary base body 2 The outer diameter is 120mm, the auxiliary base 2 is provided with an inner hole, the diameter of the inner hole is 110mm, the auxiliary base 2 is interference-fitted on the connection part 11, and the length of the connection part 11 is 1mm shorter than the length of the auxiliary base 2 , the diamond abrasiv...

Embodiment 3

[0015] Embodiment 3: An electroplated diamond grinding wheel that is easy to recycle includes a substrate 1, an auxiliary substrate 2 and a diamond abrasive layer 3, the materials of the substrate 1 and the auxiliary substrate 2 are alloy steel, and the substrate 1 is integrally provided with a cylindrical connection part 11 , the diameter of the connecting portion 11 is 52.1mm, and the joint between the connecting portion 11 and the base body 1 is integrally provided with a stepped shaft 12. The outer diameter is 60 mm, and the auxiliary base 2 is provided with an inner hole, the diameter of which is 52 mm, and the auxiliary base 2 is interference-fitted on the connection part 11, and the length of the connection part 11 is 1.5 mm shorter than that of the auxiliary base 2 , the diamond abrasive layer 3 is electroplated on the outer surface of the auxiliary substrate 2 .

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Abstract

The invention discloses an easily recovered electroplated diamond grinding wheel. The grinding wheel comprises a matrix and a diamond grinding material layer, and is characterized in that: the matrix is provided with a connecting part which is in interference fit with an auxiliary matrix; and the diamond grinding material layer is electroplated on the outer surface of the auxiliary matrix. The grinding wheel has the advantages that: when extruded by the connecting part in a connecting state, the auxiliary matrix is in an elastic expansion and deformation state; in the process of recovering the grinding wheel, the auxiliary matrix is not in the elastic deformation state any more when removed from the connecting part, so that micro gaps are formed between the diamond grinding material layer and the auxiliary matrix, the diamond grinding material layer is easily separated from the surface of the auxiliary matrix, the quick and high-efficiency separation of the diamond grinding material layer from the matrix is realized, and the electroplated diamond grinding wheel is recovered more conveniently and easily.

Description

technical field [0001] The invention relates to a diamond tool, in particular to an easily recyclable electroplated diamond grinding wheel. Background technique [0002] Diamond grinding wheels are mainly used for grinding the inner and outer circles of products made of hard and brittle materials such as cemented carbide, glass, and ceramics. The current electroplated diamond grinding wheel is mainly composed of two parts: the substrate and the abrasive layer. The abrasive layer is the main working part of the electroplated diamond grinding wheel, which includes two parts: diamond abrasive grains and bond coating. When the electroplated diamond grinding wheel is used many times, the diamond abrasive grains in the abrasive layer are worn away and the abrasive layer becomes thinner, and the electroplated diamond grinding wheel with remaining diamond abrasive grains loses its cutting ability and is scrapped. However, because diamond abrasive grains are relatively expensive, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D5/00
Inventor 于爱兵王燕琳
Owner NINGBO UNIV
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