Direct current offset probe card for radio frequency test

Abstract

The invention provides a direct current offset probe card for radio frequency test. The direct current offset probe card is characterized by comprising a sectorial probe card base plate, wherein a plurality of signal circuits and grounding circuits are arranged on the probe card base plate; at least one grounding circuit is arranged in a space between the signal circuits and conducts an electrical protection function of effectively avoiding the interference of external noise with the signal circuit; a connector is arranged at leading-out terminal of the signal circuit for connecting offset signals of test equipment; one end of the signal circuit is connected with the mounting position of the connector, and the other end of the signal circuit is connected with a probe; and the back of the signal circuit is provided with a shockproof circuit. The direct current offset probe card has the advantages that: the signal circuits transmit the offset signals of the test equipment, and the grounding circuits are electrically connected to the electric potential zero point of a tester and serves as the reference data of characteristic impedance of each signal circuit; and different capacitors and resisters are arranged according to different tested devices so as to reduce the interferences between signals. The direct current offset probe card is simple in structure design and is suitable for standard production. The direct current offset probe card can reduce signal noise and circuit oscillation and improve the on-line testing quality of radio frequency.

Description

technical field [0001] The invention relates to a special-shaped DC bias probe card with anti-shock circuit design for radio frequency testing, which belongs to the field of integrated circuit design technology. Background technique [0002] The probe card is to directly contact the probe on the probe card with the chip test pad on the radio frequency integrated circuit chip, cooperate with the test equipment and software control to transmit the test signal through the circuit board on the probe card to the probe and even the chip. To achieve the purpose of automated chip-level testing, the arrangement density of the probes needs to be fine enough to correspond to the gap between adjacent test pads on the chip, and a single probe card can be widely used in integrated circuit chips with different manufacturing technologies. The circuit board design of the needle card often does not use the specific wiring layout as the circuit transmission structure, but sets the jumper struc...

AI Technical Summary

Problems solved by technology

At present, the probe card substrate provided by the probe card manufacturer is mainly used for DC on-wafer testing. The size of the substrate is too large to meet the requirements of RF on-wafer testing. In addition, the substrate circuit does not have a special anti-shock

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