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Method for producing electroplated board edge of circuit board

A production method and circuit board technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as the inability to effectively control the static electricity of electronic components, and achieve metallization, smoothness, and processing technology simple effect

Active Publication Date: 2012-07-18
广东依顿电子科技股份有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high-density development of electronic products, the traditional design has been unable to effectively control the electrostatic prevention of electronic components

Method used

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  • Method for producing electroplated board edge of circuit board
  • Method for producing electroplated board edge of circuit board

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Experimental program
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Effect test

Embodiment Construction

[0047] The present invention will be further described below in conjunction with description of drawings and specific embodiments:

[0048] Such as figure 1 The illustrated circuit board of the present invention includes a board body 1 , and a copper plating layer 2 for electrostatic discharge protection lines is provided on at least one side of the board body 1 .

[0049] The production method of circuit board electroplating board edge of the present invention comprises the following process steps:

[0050] 1) Pre-process treatment

[0051] Mainly include: ①incoming material inspection; ②cutting CCL; ③exposure, development; ④pressing plate; ⑤drilling; ⑥board washing, drying and other processes;

[0052] The specific method is: use an automatic cutting machine to cut the large material into the most suitable small material for the copper clad laminate that has passed the inspection; paste a layer of photosensitive material (dry film) on the surface of the copper clad laminat...

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Abstract

The invention discloses a method for producing an electroplated board edge of a circuit board. The circuit board comprises a board body, wherein an electrostatic discharge guard wire copper-plated layer is arranged on at least one side of the board body. The production method comprises the following steps of: 1) preprocessing; 2) routing; 3) copper depositing; 4) panel electroplating; 5) external circuit pattern transferring; 6) circuit electroplating; 7) etching; 8) intermediate detecting, solder mask and character printing; 9) periphery forming; 10) electrical test and anti-oxidation organic film coating; and 11) checking and packaging. The invention aims to overcome the disadvantages of the prior art and provides a method for producing the electroplated board edge of the circuit board, which has the advantages of high quality, simple process and high performance of plating copper on the side of the circuit board.

Description

【Technical field】 [0001] The invention relates to a production method of an electroplated edge of a circuit board. 【Background technique】 [0002] With the rapid development of electronic products and the advancement of assembly technology, etc., the printed circuit board is being pushed towards a high-density direction. However, the problem of static electricity is the first major problem to be solved by electronic products. The motherboard used for mounting electronic components - the printed circuit board also inevitably has the problem of electrostatic discharge. Therefore, anti-static has become an important part to be solved in the design and manufacture of printed circuit boards. [0003] Ordinary printed circuit board design can achieve the purpose of anti-static by increasing the area of ​​the ground copper surface and adding conductive micro-holes in the area of ​​the copper surface, or designing a multi-layer circuit board with several layers as ground layers. H...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/18
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
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