Circuit board wet-lamination method and device

A technology of wet laminating film and circuit boards, which is applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc. It can solve problems such as pits on the surface of circuit boards and low yields at scratches, and achieve coating water volume Stable and reliable, improved binding force, stable and reliable coating effect

Inactive Publication Date: 2011-02-02
代芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a method and device for applying wet film, so as to solve the problem of low yield of pits and scratches on the surface of the circuit board that cannot be overcome in the existing film-attaching method

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  • Circuit board wet-lamination method and device
  • Circuit board wet-lamination method and device
  • Circuit board wet-lamination method and device

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Embodiment Construction

[0031] The technical solutions of the present invention will be further described below in combination with specific implementation examples.

[0032] Such as figure 1 As shown, the specific embodiment of the present invention is: provide a kind of circuit board wet-process film sticking method, comprise the steps:

[0033]Step 100: Clean and dry the surface of the circuit board: first clean the surface of the circuit board. This cleaning process is usually composed of a series of processes, which include physical cleaning and chemical cleaning and subsequent washing cleaning. Physical cleaning The methods include grinding with nylon brush, grinding with nylon brush and volcanic ash, grinding with nylon brush and emery (that is, aluminum oxide), grinding with non-woven cloth, etc. After grinding, it needs to be cleaned with clean water; the method of chemical cleaning is to go through degreasing agent first After degreasing treatment, use ordinary micro-etching method or ult...

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Abstract

The invention relates to a circuit board wet-lamination method and a circuit board wet-lamination device. The method comprises the following steps of: cleaning and blow-drying the surface of a circuit board, wetting the surface of the circuit board with water in a way of spraying water mist onto the surface of the circuit board or the surface of a dry film or the surfaces of both the circuit board and the dry film, laminating the dry film onto the surface of the circuit board, and then applying temperature and pressure to tightly attach the dry film onto the surface of the circuit board. A spray type water coating device required by the method consists of a water mist generation device, a nozzle and spray direction regulation device, a sensing device and an outer cover. Compared with a conventional direct dry-film lamination method, the method can effectively increase the yield rate and improve the quality of the circuit board.

Description

technical field [0001] The present invention relates to a method and device for wet film sticking of circuit boards, which comprises: after the surface of the circuit board is purified and dried, the surface of the circuit board is wetted with water, and the wetting treatment is carried out on the surface of the circuit board or the dry film surface or The method of spraying water mist on both surfaces at the same time, the sprayed water mist is ultra-fine diameter water mist; then the dry film is pasted on the surface of the circuit board, and temperature and pressure are applied to make the dry film adhere tightly to the surface of the circuit board superior. By adopting this method, better production quality and production yield can be obtained. Background technique [0002] The traditional circuit board film attachment method is to directly paste dry film on the surface of the circuit board to make circuit board graphics. Because there will always be some defects on th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B38/00
Inventor 代芳
Owner 代芳
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