Scaffold arranged in electroplating bath and provided with hole on side edge

Abstract

The invention discloses a scaffold which is arranged in an electroplating bath and provided with a hole on a side edge. The scaffold is arranged in the solution of the electroplating bath; coated metal connected with the anode of a power supply is arranged in the electroplating bath; the top of the scaffold is provided with a rack connected with the cathode of the power supply; the rack is provided with a plurality of collets for clamping a plated part; the clamped plated part is positioned below the rack; and the front and back ends of the rack are provided with elevating devices for controlling the rack to ascend and descend. The scaffold is characterized in that: the scaffold consists of a front fixing plate, a back fixing plate, a left anode baffle plate, a right anode baffle plate and a middle beam; the middle beam is arranged between the middle part of the front fixing plate and the middle part of the back fixing plate; and the upper parts of the left anode baffle plate and the right anode baffle plate are provided with through holes respectively. The problems of non-uniform thicknesses of clad layers at the bottom of the plated part and at other positions of the plated part and the ununiformity of the whole clad layers in the prior art are solved and the scaffold with the hole on the side edge which has a simple structure and can improve the uniformity of the clad layers is provided.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a floating rack arranged in an electroplating tank with holes on its side. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent corrosion and improve Abrasion resistance, conductivity, light reflection and aesthetic enhancement. During electroplating, the plated metal is connected to the anode, and the plated piece is connected to the cathode. The cathode and anode are connected by the electrolyte solution of the plated metal ions, and the plated piece must be immersed in the electrolyte solution. Since the depth of the anode in the electroplating tank is deeper than the depth of the cathode, the current genera...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems in the prior art that the thickness of the coating layer on the bottom of the plated part is different from that of other parts of the plated part, and that the entire coating layer is not uniform enough, the present invention provides a floating frame with holes on the side that has a simple structure and can improve the uniformity of the coating layer.

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