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Method and device for measuring dynamic fracture property of laser shock loading material

A technology of laser shock and measurement method, which is applied in the direction of measuring devices, analyzing materials, strength characteristics, etc., can solve the problems of large size, insufficient height, and more material waste, and achieve the effect of improving loading rate and reliable fracture characteristics

Inactive Publication Date: 2011-02-16
JIANGSU UNIV
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Problems solved by technology

[0008] In the member loading technique, the loading rate of member loading Not high enough, about 10 5 ~10 6 MPa m 1 / 2 / s and the loading rate of explosives loaded Although it can reach 10 8 order of magnitude, but the size of the sample is required to be larger in the test, and the material waste is more

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  • Method and device for measuring dynamic fracture property of laser shock loading material
  • Method and device for measuring dynamic fracture property of laser shock loading material
  • Method and device for measuring dynamic fracture property of laser shock loading material

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[0029] Feasibility analysis of the device: The size of the three-point bending sample 4 is made according to the provisions of GB / T 21143-2007 (Unified test method for quasi-static fracture toughness of metal materials). According to the definition of stress wave velocity: It can be calculated that most of the stress wave velocities are in the range of 1000-5000m / s. The WZDD-1 multi-spark camera optical system 13 adopts small-sized electric spark light sources arranged in a 4×4 square, and can record 16 dynamic photoelastic images that have gone through a period of time in one operation. The amplitude of the multi-spark camera optical system 13 can be adjusted to 2~80×10 4 frame / second, that is, the minimum time interval is 1.25 microseconds, and the shortest time history of sixteen photos is 20 microseconds. Therefore, it can be photographed that the distance that the stress wave 17 propagates in the three-point bending specimen 4 is 20-100 mm. This distance can be used a...

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Abstract

The invention relates to a method for testing mechanical property of a material under the action of stress wave, in particular to a method and a device for measuring dynamic fracture property of a laser shock loading material. The method comprises the following steps of: loading a three-point bent sample (4) with preformed crackles (1) by using shock wave induced by nanosecond-scale laser pulse (8), and detecting the propagation property of the stress wave (17) in the three-point bent sample (4) and the expansion property of the crackles by adopting a method of combining photo-elasticity and moire. The device acquires a high-speed transient photo-elastic image of interaction of the material and the stress wave under the condition of a high loading rate by using a multi-spark camera optical system (13), can clearly observe the propagation of the laser-induced short pulse stress wave (17), and can accurately and reliably acquire the fracture property of the material by processing.

Description

technical field [0001] The invention relates to a test method for the mechanical properties of a material under the action of a stress wave, in particular to a method and a device for measuring the dynamic fracture properties of a laser shock loaded material. Background technique [0002] The dynamic fracture toughness (dynamic crack initiation toughness) of the material is an important parameter of the dynamic characteristics of the material, which is the limit value of the dynamic stress intensity factor of the cracked body under the action of dynamic load, and is the toughness parameter of the material. As a material parameter in modern damage tolerance design, it can make up for the basic material parameters (K IC , J IC ) does not consider the effects of inertia and loading rate, and cannot predict the safety of materials and structures under dynamic loads. [0003] The two most important aspects of testing for the measurement of dynamic fracture properties are loadin...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/02G01N3/313
Inventor 张永康钱晓明姜银方鲁金忠管海兵张磊吴忠
Owner JIANGSU UNIV
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