Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for measuring dynamic fracture property of laser shock loading material

A technology of laser shock and measurement method, applied in the direction of measurement device, analysis material, strength characteristics, etc., can solve the problems of large size, not high enough, more material waste, etc., to achieve the effect of improving loading rate and reliable fracture characteristics

Inactive Publication Date: 2014-02-12
JIANGSU UNIV
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the member loading technique, the loading rate of member loading Not high enough, about 10 5 ~10 6 MPa m 1 / 2 / s and the loading rate of explosives loaded Although it can reach 10 8 order of magnitude, but the size of the sample is required to be larger in the test, and the material waste is more

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for measuring dynamic fracture property of laser shock loading material
  • Method and device for measuring dynamic fracture property of laser shock loading material
  • Method and device for measuring dynamic fracture property of laser shock loading material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Feasibility analysis of the device: The size of the three-point bending sample 4 is made according to the provisions of GB / T 21143-2007 (Unified test method for quasi-static fracture toughness of metal materials). According to the definition of stress wave velocity: It can be calculated that most of the stress wave velocities are in the range of 1000-5000m / s. The WZDD-1 multi-spark camera optical system 13 adopts small-sized electric spark light sources arranged in a 4×4 square, and can record 16 dynamic photoelastic images that have gone through a period of time in one operation. The amplitude of the multi-spark camera optical system 13 can be adjusted to 2~80×10 4 frame / second, that is, the minimum time interval is 1.25 microseconds, and the shortest time history of sixteen photos is 20 microseconds. Therefore, it can be photographed that the distance that the stress wave 17 propagates in the three-point bending specimen 4 is 20-100 mm. This distance can be used a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for testing mechanical property of a material under the action of stress wave, in particular to a method and a device for measuring dynamic fracture property of a laser shock loading material. The method comprises the following steps of: loading a three-point bent sample (4) with preformed crackles (1) by using shock wave induced by nanosecond-scale laser pulse (8), and detecting the propagation property of the stress wave (17) in the three-point bent sample (4) and the expansion property of the crackles by adopting a method of combining photo-elasticity and moire. The device acquires a high-speed transient photo-elastic image of interaction of the material and the stress wave under the condition of a high loading rate by using a multi-spark camera optical system (13), can clearly observe the propagation of the laser-induced short pulse stress wave (17), and can accurately and reliably acquire the fracture property of the material by processing.

Description

technical field [0001] The invention relates to a test method for the mechanical properties of a material under the action of a stress wave, in particular to a method and a device for measuring the dynamic fracture properties of a laser shock loaded material. Background technique [0002] The dynamic fracture toughness (dynamic crack initiation toughness) of the material is an important parameter of the dynamic characteristics of the material, which is the limit value of the dynamic stress intensity factor of the cracked body under the action of dynamic load, and is the toughness parameter of the material. As a material parameter in modern damage tolerance design, it can make up for the basic material parameters (K IC , J IC ) does not consider the effects of inertia and loading rate, and cannot predict the safety of materials and structures under dynamic loads. [0003] The two most important aspects of testing for the measurement of dynamic fracture properties are loadin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/313G01N3/02
Inventor 张永康钱晓明姜银方鲁金忠管海兵张磊吴忠
Owner JIANGSU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com