Semiconductor packaging structure and manufacture process thereof

Abstract

The invention discloses a semiconductor packaging structure and a manufacture process thereof. The manufacture process of the semiconductor packaging structure comprises the steps of: configuring a packaging mother board on a support tool, wherein the packaging mother board is provided with a grid wall arranged vertically on the packaging mother board and the grid wall defines a plurality of concave parts on the packaging mother board; respectively jointing a plurality of first chips to the concave parts of the packing mother board, wherein each first chip is provided with silicon penetrating guide holes inside; forming first primer between each first chip and the corresponding packaging mother board; forming a cladding layer on the support tool; thinning the cladding layer and the grid wall from the upside of the support tool until the cladding layer above the grid wall and the first chip is completely removed; jointing a plurality of second chips to the first chips; forming second primer between each second chip and the corresponding first chip; separating the support tool from the packaging mother board, and cutting the packaging mother board to obtain a plurality of packaging units.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, and in particular to a stacked semiconductor element packaging technology. Background technique [0002] In today's information society, the design of electronic products is moving toward light, thin, short, and small. Therefore, packaging technologies such as stacked semiconductor device packaging have been developed that are conducive to miniaturization. [0003] Stacked semiconductor element packaging is to package multiple semiconductor elements in the same package structure by vertical stacking, which can increase the packaging density to make the package miniaturized, and can shorten the signal transmission between semiconductor elements by using three-dimensional stacking The path length can increase the speed of signal transmission between semiconductor components, and semiconductor components with different functions can be combined in the same package. [0004] An existing stacke...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a semiconductor packaging structure and its manufacturing process, which can avoid the problem of surface contamination of the substrate, lower chip or packaging colloid caused by the residual protective glue in the existing manufacturing process after grinding

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