Making method of ceramic matrix flex-rigid multilayer circuit board

Abstract

The invention discloses a making method of a ceramic matrix flex-rigid multilayer circuit board, which is characterized by comprising the following steps of, firstly, making an aluminum nitride ceramic circuit board; secondly, making a flexible circuit board; thirdly, making an epoxy resin circuit board; fourthly, pressing the aluminum nitride ceramic circuit board, the flexible circuit board andthe epoxy resin circuit board; fifthly, adopting laser perforating equipment on a multilayer board in the fourth step to make a through hole which penetrates through the upper surface and the lower surface of the multilayer board; sixthly, printing welding resistance inks on a position without welding an electronic element on the multilayer board; seventhly, screen printing a word in a preset position on the multilayer board; and eighthly, adopting laser cutting equipment to cut the circuit board into a preset specification, and obtaining the ceramic matrix flex-rigid multilayer circuit board. The invention has the purposes of overcoming the disadvantages in the prior art and providing the making method of the ceramic matrix flex-rigid multilayer circuit board, which has the advantages ofsimple technology, high wiring density, excellent 3D connecting characteristic and good heat conductivity.

Description

Technical field [0001] The invention relates to a method for manufacturing a ceramic base rigid-flex combined multilayer circuit board. Background technique [0002] At present, there are ordinary epoxy resin multilayer boards, flexible circuit boards (soft boards), rigid-flex circuit boards with epoxy resin + flexible circuit boards, and ordinary Al 2 O 3 As the main component of ceramic circuit boards, their advantages and disadvantages are as follows: [0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, easy to solder components, but its thermal conductivity and heat dissipation are poor, the expansion and shrinkage size is difficult to control, and the reliability is difficult to improve; [0004] Flexible circuit board (soft board): It has the characteristics of small size, light weight, movable, curved, and torsion surface will not damage the wires, and can comply with different shapes and specia...

AI Technical Summary

Problems solved by technology

[0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve;

[0004] Flexible circuit board (soft board): it has the characteristics of small size, light weight, movable, bending, and twisting surface without damaging the wires, and can comply with different shapes and special package sizes, 3D assembly and wide range of dynamic applications; weak point Its dimensional stability is extremely poor, the wiring density is low, it is not resistant to high temperature, and it is not easy to make multilayer boards.

[0005] Ordinary alumina ceramic circuit board: it has the advantages of high heat dissipation and corrosion resistance, high insulation performance and excellent high-frequency characteristics, low expansion coefficient, stable chemical performance and high thermal conductivity, and non-toxic; but because of its It has the characteristics of high hardness, so it is brittle and difficult to machine. At the same time, because of its flat surface, it is difficult to achieve interlayer conduction through electroplating and it is difficult to effectively combine with other layers to form a multilayer circuit board;

[0006] Traditional circuit boards have single advantages and cannot have high thermal conductivity, high integration and 3D connection functions at the same time, and cannot meet the market's demand for circuit boards with high connectivity, high density, and good thermal conductivity

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