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Method for manufacturing ceramic-base rigid circuit board

A manufacturing method and circuit board technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of difficulty in improving reliability, good thermal conductivity, poor thermal conductivity and heat dissipation, etc., and achieve high temperature resistance, high integration, and good thermal conductivity sexual effect

Inactive Publication Date: 2013-02-13
广东达进电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve;
[0004] Ordinary alumina ceramic circuit board: it has the advantages of high heat dissipation and corrosion resistance, high insulation performance and excellent high-frequency characteristics, low expansion coefficient, stable chemical performance and high thermal conductivity, and non-toxic; but because of its It has the characteristics of high hardness, so it is brittle and difficult to machine. At the same time, because of its flat surface, it is difficult to achieve interlayer conduction through electroplating and it is difficult to effectively combine with other layers to form a multilayer circuit board;
[0005] Traditional circuit boards have single advantages, cannot have high thermal conductivity and high integration at the same time, and cannot meet the market's demand for circuit boards with high connectivity, high density, and good thermal conductivity

Method used

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  • Method for manufacturing ceramic-base rigid circuit board

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Effect test

Embodiment 1

[0042] A method for manufacturing a ceramic-based rigid circuit board of the present invention comprises the following steps:

[0043] A. Making aluminum nitride ceramic circuit boards

[0044] a1. Make the inner layer graphics on the pretreated aluminum nitride ceramic copper clad laminate;

[0045] It mainly includes: incoming material inspection → degreasing → pickling → drying → film pressing → exposure → development → etching → film removal → drying and other processes;

[0046] The specific method is: clean the surface of the aluminum nitride ceramic copper clad substrate that has passed the inspection, use sodium persulfate to micro-etch the copper clad layer of the aluminum nitride ceramic copper clad substrate, and remove the oil and surface on the copper clad layer. Compared with the cleaning of the circuit board substrate by physical methods, it is more effective in preventing damage to the aluminum nitride ceramic copper-clad substrate, and the micro-etched alumin...

Embodiment 2

[0092] A method for manufacturing a ceramic-based rigid circuit board of the present invention comprises the following steps:

[0093] A. Making aluminum nitride ceramic circuit boards

[0094] a1. Make the inner layer graphics on the pretreated aluminum nitride ceramic copper clad laminate;

[0095] It mainly includes: incoming material inspection → degreasing → pickling → drying → film pressing → exposure → development → etching → film removal → drying and other processes;

[0096] The specific method is: clean the surface of the aluminum nitride ceramic copper clad substrate that has passed the inspection, use ammonium persulfate to micro-etch the copper clad layer of the aluminum nitride ceramic copper clad substrate, and remove the oil and surface on the copper clad layer. Compared with the cleaning of the circuit board substrate by physical methods, it is more effective in preventing damage to the aluminum nitride ceramic copper-clad substrate, and the micro-etched alum...

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Abstract

The invention discloses a method for manufacturing a ceramic-base rigid circuit board, which is characterized by comprising the following steps of: A, manufacturing an aluminium nitride ceramic circuit board; B, manufacturing an epoxy resin circuit board; C, laminating the aluminium nitride ceramic circuit board and the epoxy resin circuit board; D, making a through hole penetrating the multi-layer board obtained in the step C by using laser punching equipment; and E, cutting the circuit board into a predetermined specification by using laser cutting equipment to obtain the ceramic-base rigid circuit board. The invention aims to overcome the disadvantages in the prior art, and provides a simple method for manufacturing the ceramic-base rigid circuit board with high integration level and high thermal conductivity.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic-based rigid circuit board. Background technique [0002] At present, there are ordinary epoxy resin multilayer boards in the industry, there are flexible circuit boards (soft boards), there are rigid bonded circuit boards with epoxy resin + flexible circuit boards, and there are ordinary Al 2 o 3 As the main component of ceramic circuit boards, their advantages and disadvantages are as follows: [0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve; [0004] Ordinary alumina ceramic circuit board: it has the advantages of high heat dissipation and corrosion resistance, high insulation performance and excellent hi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 王斌陈华巍盛从学姚超谢兴龙杨晓乐
Owner 广东达进电子科技有限公司
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