Method for manufacturing ceramic-based interconnected rigid flexible combined multilayer circuit board

Abstract

The invention discloses a method for manufacturing a ceramic-based interconnected rigid flexible combined multilayer circuit board, which is characterized by comprising the following steps of: A. manufacturing an aluminum nitride ceramic circuit board; B. manufacturing a flexible circuit board; C. manufacturing an epoxy resin circuit board; D. laminating the aluminum nitride ceramic circuit board, the flexible circuit board and the epoxy resin circuit board; E. manufacturing a through hole passing through the upper surface and the lower surface of the multilayer board on the multilayer board obtained in the step D by adopting laser drilling equipment, processing the hole with a conducting material, then drying to obtain a through hole; F. printing solder resist ink in positions on the multilayer board, at which electronic elements do not need to be welded; G. silk printing characters in preset positions on the multilayer board; and H. cutting the circuit board into predetermined specifications by adopting laser cutting equipment to obtain the ceramic-based rigid flexible multilayer circuit board. The invention provides the manufacturing method of the ceramic-based interconnected rigid flexible combined multilayer circuit board with simple process, high wiring density, good 3D connection performance and good thermal conductivity.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic-based interconnection rigid-flexible multilayer circuit board. Background technique [0002] At present, there are ordinary epoxy resin multilayer boards in the industry, there are flexible circuit boards (soft boards), rigid-flexible circuit boards with epoxy resin + flexible circuit boards, and ordinary Al 2 o 3 As the main component of ceramic circuit boards, their advantages and disadvantages are as follows: [0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy soldering of components, but its thermal conductivity and heat dissipation are poor, and it is difficult to control the size of expansion and contraction, and it is difficult to improve reliability; [0004] Flexible circuit board (soft board): it has the characteristics of small size, light weight, movable, bending, and twisting surface w...

AI Technical Summary

Problems solved by technology

[0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy soldering of components, but its thermal conductivity and heat dissipation are poor, and it is difficult to control the size of expansion and contraction, and it is difficult to improve reliability;

[0004] Flexible circuit board (soft board): it has the characteristics of small size, light weight, movable, bending, and twisting surface without damaging the wires, and can comply with different shapes and special package sizes, and has a wide range of 3D assembly and dynamic applications; weaknesses Its dimensional stability is extremely poor, the wiring density is low, it is not resistant to high temperature, and it is not easy to make multilayer boards.

[0005] Ordinary alumina ceramic circuit board: it has the advantages of high heat dissipation and corrosion resistance, high insulation performance and excellent high-frequency characteristics, low expansion coefficient, stable chemical performance and high thermal conductivity, and non-toxic; but because of its It has the characteristics of high hardness, so it is brittle and difficult to machine. At the same time, because of its flat surface, it is difficult to achieve interlayer conduction through electroplating and it is difficult to effectively combine with other layers to form a multilayer circuit board;

[0006] Traditional circuit boards have single advantages and cannot have high thermal conductivity, high integration and 3D connection functions at the same time, and cannot meet the market's demand for circuit boards with high connectivity, high density, and good thermal conductivity

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