Cutting device

A cutting device and cutting fluid technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problem of difficulty in completely preventing chip adhesion, and achieve the effect of preventing tightening.
CN101992504AInactive Publication Date: 2011-03-30DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
DISCO CORP
Publication Date
2011-03-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a cutting device capable of preventing borings from being attached to an object to be machined. The cutting device comprises a chuck worktable, a cutter and a cutter cover. The cutting device also comprises a pool liquid supply component for supplying a pool liquid to the object to be machined between the bottom of the cutter cover and the object to be machined; a cutting liquid supply component for supplying a cutting liquid to the cutter from a cutting liquid ejecting port; and a waste liquid recovering component arranged on one side where the cutting liquid is sprayed along the rotation of the cutter. The waste liquid recovering component includes a barrel in which one end is connected with a side wall of an cutting liquid discharge opening part of the cutter cover in a manner of a prescribed angle relative to a holding surface of the chuck worktable; and a pumping source connected with the other end of the barrel. The barrel is provided with an opening part facing to the holding surface of the chuck worktable on one end side, parts of the cutting liquid and the pool liquid rotating along with the rotation of the cutter are discharged from the object to be machined by means of the pumping source.
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Description

technical field

[0001] The present invention relates to a cutting device comprising: a chuck table holding a workpiece; and a cutting tool for cutting the workpiece held by the chuck table. and a blade cover arranged to cover the outer periphery of the cutting tool. Background technique

[0002] In the manufacturing process of semiconductor devices, a plurality of devices such as IC (Integrated Circuit: Integrated Circuit), LSI (Large-scale Integration: Large-Scale Integration) or solid-state imaging devices are formed on the surface of a semiconductor wafer. Then, the wafer is divided into individual devices by cutting the wafer with a cutting device along planned dividing lines called streets that divide the individual devices.

[0003] As the cutting device, what is called a dicer is widely used, and the dicer includes a cutting member including a cutting blade. A cutting tool has a cutting edge made of superhard abrasive grains such as diamond or CBN (Cubic Boron Nitri...

Claims

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