Cutting device
A cutting device and cutting fluid technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problem of difficulty in completely preventing chip adhesion, and achieve the effect of preventing tightening.
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[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 The appearance of the cutting device 2 according to the first embodiment of the present invention is shown. On the front side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT (Cathode Ray Tube: Cathode Ray Tube) for displaying a guidance screen for an operator or an image captured by an imaging unit described later is provided on the upper part of the device.
[0024] Reference numeral 8 denotes a wafer cassette, and a plurality of (for example, 25) semiconductor wafers supported by a ring frame via dicing tapes are accommodated in the wafer cassette 8 . The wafer cassette 8 is placed on a cassette elevator 9 capable of moving up and down.
[0025] Arranged behind the wafer cassette 8 is an unloading and loading member 10 that unlo...
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