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Cutting device

A cutting device and cutting fluid technology, applied in the direction of fine working devices, working accessories, stone processing equipment, etc., can solve the problem that it is difficult to completely prevent the adhesion of chips

Active Publication Date: 2015-04-08
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, there is a problem that even with the devices or methods disclosed in Patent Documents 1 and 2, it is difficult to completely prevent chips from adhering to the workpiece.

Method used

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Examples

Experimental program
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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 The appearance of the cutting device 2 according to the first embodiment of the present invention is shown. On the front side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT (Cathode Ray Tube: Cathode Ray Tube) for displaying a guidance screen for an operator or an image captured by an imaging unit described later is provided on the upper part of the device.

[0029] Reference numeral 8 denotes a wafer cassette, and a plurality of (for example, 25) semiconductor wafers supported by a ring frame via dicing tapes are accommodated in the wafer cassette 8 . The wafer cassette 8 is placed on a cassette elevator 9 capable of moving up and down.

[0030] Arranged behind the wafer cassette 8 is an unloading and loading member 10 that unlo...

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PUM

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Abstract

The present invention provides a cutting device capable of preventing borings from being attached to an object to be machined. The cutting device has a cutter cover and a liquid wall forming component, wherein the liquid wall forming component is provided with a pair of ejecting ports. When a rotating direction located on a lowest point of a cutter is a rotating direction of the cutter, the pair of ejecting ports are arranged on two sides of the cutter on an upstream side of the rotating direction of the cutter in a manner that an projecting end from an opening arranged on the bottom of the cutter cover is held, the liquid wall forming component ejects liquid to form a liquid wall from a downstream side of the rotating direction of the cutter from the ejecting ports along the rotating direction of the cutter, so as to form a pair of liquid walls longer than the opening and extending along the rotating direction of the cutter, such that a clearance between the cutter cover and the object to be machined is enclosed.

Description

technical field [0001] The present invention relates to a cutting device comprising: a chuck table holding a workpiece; and a cutting tool for cutting the workpiece held by the chuck table. and a blade cover arranged to cover the outer periphery of the cutting tool. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of devices such as IC (Integrated Circuit: Integrated Circuit), LSI (Large-scale Integration: Large-Scale Integration) or solid-state imaging devices are formed on the surface of a semiconductor wafer. Then, the wafer is divided into individual devices by cutting the wafer with a cutting device along planned dividing lines called streets that divide the individual devices. [0003] As the cutting device, what is called a dicer is widely used, and the dicer includes a cutting member including a cutting blade. A cutting tool has a cutting edge made of superhard abrasive grains such as diamond or CBN (Cubic Boron Nitri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B28D7/00
Inventor 迈克尔·加德
Owner DISCO CORP