Real-time monitoring method of acceptance test of wafer

Abstract

The invention discloses a real-time monitoring method of an acceptance test of a wafer, the wafer is divided into a plurality of points, each point comprises a plurality of test parameters for testing, and part of the parameters are key parameters, and the real-time monitoring method comprises the following steps: setting the type and the judgment standard of the acceptance test of the wafer; carrying out the acceptance test on the wafer; collecting and managing test data obtained by the acceptance test of the wafer; and carrying out judgment according to the type and the judgment standard, monitoring the test data, continuing the test if being judged to be qualified, otherwise, suspending the test and transferring into manual handling. Compared with the prior art, the real-time monitoring method of the acceptance test of the wafer can monitor the data tested by a chip on each wafer, find whether a probe of a probe card is aimed at a probe point on the corresponding chip in time, further avoid the follow-up batch of the chips to be tested from being scratched and reduce the loss.

Description

technical field [0001] The invention relates to an electronic testing method, in particular to a real-time monitoring method for wafer acceptance testing in the semiconductor field. Background technique [0002] Wafer Acceptance Test (WAT: Wafer Acceptance Test) is an electrical test performed before packaging after the wafer (wafer) is manufactured through a complex process, and finally a lattice of bare die (die) is formed on the wafer. , such as parameters such as current, voltage or leakage current of each chip on the wafer are tested. A test system for WAT usually consists of a probe card, a wafer fixture, a wafer image calibration device, and a test machine. [0003] In the process of traditional testing, due to the influence of the calibration deviation of the wafer image calibration device, or the poor contact between the probes on the probe card and the wafer, the ambient temperature or humidity changes around the test machine, the test results and The data is not...

AI Technical Summary

Problems solved by technology

[0004] During the test process, the probe points on the wafer used to contact the probes on the probe card are relatively small and closely arranged, and calibration deviation is prone to occur when the wafer image calibration device performs image calibration on the wafer , so that it is difficult for the probe to touch the probe points on the corresponding chip correctly, and the probe is easy to scratch the chip or wafer. If it is not found in time, the entire batch of chips or wafers will be scrapped

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