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Water-reactive Al composite material, water-reactive Al film, method for production of the Al film, and structural member for film-forming chamber

A composite material and manufacturing method technology, applied in chemical instruments and methods, metal material coating process, semiconductor/solid-state device manufacturing, etc., to achieve the effect of increasing the number of reuses and low cost

Active Publication Date: 2011-04-13
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the status quo is that only film-forming materials with a unit price offset by the recycling cost are recycled

Method used

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  • Water-reactive Al composite material, water-reactive Al film, method for production of the Al film, and structural member for film-forming chamber
  • Water-reactive Al composite material, water-reactive Al film, method for production of the Al film, and structural member for film-forming chamber
  • Water-reactive Al composite material, water-reactive Al film, method for production of the Al film, and structural member for film-forming chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] 2NAl, 3NAl, and 4NAl were used, and the relationship between the purity of Al in the Al-In composition to which In was added, the amount of impurity Cu in Al, and the solubility of the thermally sprayed film obtained was studied. The amount of In added is based on the weight of Al.

[0060] 2NAl (impurity Cu: <400ppm)-3wt%In

[0061] 3NAl (impurity Cu: 70ppm)-3wt%In

[0062] 3NAl (impurity Cu: below the detection limit)-3wt%In

[0063] 4NAl (impurity Cu: below the detection limit)-3wt%In

[0064] Using a thermal spraying material that mixes Al and In in the above proportions, dissolves In uniformly in Al, and processes it into a rod shape, it is sprayed by molten rod flame (heat source: C 2 h 2 -O 2 gas, about 3000°C), in the air atmosphere, spray on the surface of the aluminum substrate to form a sprayed coating. For each of the thermally sprayed coatings obtained in this way, instead of the heat history received by the film formation process, heat treatment at roo...

Embodiment 2

[0068] In this example, the relationship between the amount of Cu impurity in the Al-In composition using 4NAl and In added thereto, and the solubility of the thermally sprayed film obtained was investigated. The amount of In added is based on the weight of Al.

[0069] 4NAl (impurity Cu: below the detection limit)-3wt%In

[0070] 4NAl (impurity Cu: <10ppm)-3wt%In

[0071] 4NAl (impurity Cu: 40ppm)-2.5wt%In

[0072] 4NAl (impurity Cu: 40ppm)-3wt%In

[0073] 4NAl (impurity Cu: 10ppm)-3wt%In

[0074] 4NAl (impurity Cu: 20ppm)-3wt%In

[0075] 4NAl (impurity Cu: 30ppm)-2.5wt%In

[0076] Using a thermal spraying material that mixes Al and In in the above proportions, dissolves In uniformly in Al, and processes it into a rod shape, it is sprayed by molten rod flame (heat source: C 2 h 2 -O 2 gas, about 3000°C), in the air atmosphere, spray on the surface of the aluminum substrate to form a sprayed coating. For each of the thermally sprayed coatings obtained in this way, ins...

Embodiment 3

[0080] In an Al-In-Si composition using 4NAl and adding In and Si (total amount of Si as an impurity), the relationship between the purity of Al, the amount of Si added, and the solubility of the resulting thermally sprayed coating was investigated. The addition amounts of In and Si are based on Al weight.

[0081] 4NAl (impurity Cu: 10ppm or less)-2wt%In-0.05wt%Si

[0082] 4NAl (impurity Cu: 10ppm or less)-3wt%In-0.1wt%Si

[0083] 4NAl (impurity Cu: 10ppm or less)-4wt%In-0.5wt%Si

[0084] 5NAl (impurity Cu: 10ppm or less)-1.5wt%In-0.05wt%Si

[0085] ・5NAl (impurity Cu: 10ppm or less)-2.6wt%In-0.1wt%Si

[0086] ・5NAl (impurity Cu: 10ppm or less)-3.5wt%In-0.5wt%Si

[0087] Al, In, and Si were blended in the above-mentioned ratio (the amount of Si blended is represented by the amount of Si containing impurities), and a sprayed coating was formed in the same manner as in Example 1. About each sprayed coating obtained in this way, it heat-processed similarly to Example 1 (in ...

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PUM

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Abstract

Disclosed is a water-reactive Al composite material which comprises: an Al component selected from 2NAI to 5NAI each having a content of an impurity Cu of 40 ppm or less; and at least one metal selected from In in an amount of 2 to 5 wt% and Bi in an amount of 0.7 to 1.4 wt% both relative to the amount of Al. Also disclosed is a water-reactive Al film produced by using the material. Further disclosed is a method for producing the Al film. Still further disclosed is a structural member for a film-forming chamber, which comprises the water-reactive Al film on its surface.

Description

technical field [0001] The present invention relates to a water-reactive Al composite material, a water-reactive Al film, a method for producing the Al film, and components for a film-forming chamber, and particularly relates to water using Al in which the amount of impurity Cu is set to a predetermined amount. A reactive Al composite material, a water-reactive Al film formed from the water-reactive Al composite material, a method for producing the Al film, and a film-forming chamber component covered with the Al film. Background technique [0002] In a film-forming device for forming a thin film by sputtering, vacuum evaporation, ion plating, CVD, etc., the components for the film-forming chamber installed in the device are inevitably A film of a metal or a metal compound formed from a film-forming material is adhered. As the components for the film forming chamber, for example, an anti-adhesion plate (anti-adhesion plate) for preventing the film from adhering to the insid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/06B01J19/00C22C21/00C23C14/00C23C16/44H01L21/205
CPCC23C4/18C23C4/06C23C4/04C22C21/00C23C4/08C23C14/564C23C16/4404
Inventor 门胁丰斋藤朋子林敬荣虫明克彦
Owner ULVAC INC
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