Method for manufacturing circuit board
A manufacturing method and circuit board technology, which can be applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve problems such as the difficulty of electroplating the hole wall of the through hole, and achieve the purpose of overcoming the difficulty of electroplating the hole wall of the through hole and simplifying the production. process, the effect of improving the production yield
Active Publication Date: 2012-10-17
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
[0007] Compared with the prior art, the manufacturing method of the circuit board of the technical solution has the following advantages: First, it does not need to make a via hole, which can effectively overcome the plating via hole wall caused by making the via hole in the prior art. Difficult defects, and greatly simplify the circuit board production process, improve the yield of circuit board production
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Embodiment Construction
[0027] The method for manufacturing the circuit board provided by the technical solution will be described in detail below with reference to the drawings and multiple embodiments.
[0028] The method for manufacturing a circuit board provided in the first embodiment of the technical solution may include the following steps:
[0029] In the first step, a conductive substrate 100 is provided.
[0030] see figure 1 , the conductive substrate 100 may be electrolytic copper foil, or rolled copper foil.
[0031] In the second step, a portion of the conductive substrate is etched and removed by an image transfer process and an etching process, so that the conductive substrate 100 forms a first conductive layer 110 having a first surface 111 and a second surface 112 opposite to each other and a plurality of conductive layers. A structure of first conductive pillars 113 extending outward from the first surface 111 of the first conductive layer 110 .
[0032] First, the first photore...
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A method for manufacturing a circuit board comprises the steps of: providing a conductive substrate, removing partial conductive substrate by etching so as to form a structure that comprises a first conductive layer having opposite first and second surfaces and a plurality of first conductive columns extending outwards from the first surface, forming a first insulating layer on the first conductive layer having a third surface away from the first conductive layer, exposing the first conductive columns on the third surface of the first insulating layer, forming a second conductive layer on thefirst insulating layer, etching partial second conductive layer and the part of the first conductive columns exposed out of the third surface so as to align the first conductive columns with the third surface, making the second conductive layer into a second conductive circuit and electrically connecting the second conductive circuit to the first conductive layer through a plurality of first conductive columns.
Description
technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a circuit board manufacturing method. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards and double-sided circuit boards to multi-layer circuit boards. Multilayer circuit board refers to a circuit board with multiple layers of conductive lines, which has more wiring area and higher interconnection density, so it is widely used, see literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi , H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4):418-425. [0003] The circuit board manufacturing process usually includes steps such as exposure, development, etching, drilling, and electroplating. Taking the multi-layer circu...
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IPC IPC(8): H05K3/02H05K3/42H05K3/46
Inventor 刘瑞武
Owner AVARY HLDG (SHENZHEN) CO LTD