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Epoxy resin composition for packaging electronic element and preparation method thereof

A technology of epoxy resin and electronic components, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of affecting the encapsulation effect, the interface is easy to crack, easy to damage, etc., and achieves good formability and good bending resistance , The effect of improving wear resistance

Inactive Publication Date: 2011-04-27
上海旌纬微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the epoxy resin material used for encapsulation cannot withstand high temperature, and usually can only maintain stability at 100°C. If the temperature is higher than this, the epoxy resin encapsulated outside is easy to damage and fall off
In addition, the epoxy resin encapsulated at the connection part of the electronic component, especially the epoxy resin encapsulated at the lead-out part of the thick film circuit, once bent, the interface at the encapsulation part is easy to crack, which affects the encapsulation effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] An epoxy resin composition for encapsulation of electronic components, the epoxy resin composition comprises 40 parts by weight of bisphenol A type epoxy resin, 32 parts by weight of SiO 2 , 3 parts by weight of fumed silica, 7 parts by weight of curing agent. The curing agent is tetrahydrophthalic anhydride.

[0031] With the method for the production electronic component encapsulating compound of above-mentioned epoxy resin composition, this method is carried out as follows:

[0032] (1) raw material mixing: with the bisphenol A type epoxy resin of 40 parts by weight, the SiO of 32 parts by weight 2 , 3 parts by weight of fumed silica and 7 parts by weight of tetrahydrophthalic anhydride are mixed in no particular order;

[0033] (2) Heat the above-mentioned mixed raw materials to 70°C and stir for 40 minutes to obtain the product, which is ready for use.

[0034] When encapsulating electronic components, the electronic components are immersed in the stirred epoxy ...

Embodiment 2

[0036] An epoxy resin composition for encapsulation of electronic components, the epoxy resin composition includes 42 parts by weight of epoxy resin, 35 parts by weight of SiO 2 , 4 parts by weight of fumed silica, 8 parts by weight of curing agent. The epoxy resin is cresol novolak resin and triglycidyl tricyanate, the mass ratio of which is 1:2, and the curing agent is maleic anhydride.

[0037] With the method for the production electronic component encapsulating compound of above-mentioned epoxy resin composition, this method is carried out as follows:

[0038] (1) raw material mixing: with the epoxy resin of 42 parts by weight, the SiO of 35 parts by weight 2 , 4 parts by weight of fumed silica and 8 parts by weight of maleic anhydride are mixed in no particular order;

[0039] (2) Heat the above-mentioned mixed raw materials to 60°C and stir for 60 minutes to obtain the product, which is ready for use.

[0040] When encapsulating electronic components, the electronic ...

Embodiment 3

[0042] An epoxy resin composition for encapsulation of electronic components, the epoxy resin composition includes 50 parts by weight of epoxy resin, 33 parts by weight of SiO 2 , 9 parts by weight of fumed silica, 10 parts by weight of curing agent and 1 part by weight of pigment. Described epoxy resin is glycidyl ether type epoxy resin and triglycidyl tricyanate, and its mixing mass ratio is 2: 2.5; Curing agent is maleic anhydride, nagylic anhydride and pyromellitic anhydride, mixing The mass ratio is 1:1:2.

[0043] With the method for the production electronic component encapsulating compound of above-mentioned epoxy resin composition, this method is carried out as follows:

[0044] (1) raw material mixing: with the epoxy resin of 50 parts by weight, the SiO of 33 parts by weight 2 , the fumed silica of 9 parts by weight, the curing agent of 10 parts by weight and the pigment iron oxide red of 0.5 parts by weight are mixed in no particular order;

[0045] (2) Heat the ...

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PUM

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Abstract

The invention relates to an epoxy resin composition for packaging an electronic element and a preparation method thereof. The composition comprises the following components in part by weight: 40 to 50 parts of epoxy resin, 30 to 40 parts of SiO2, 2 to 7 parts of fumed silica and 7 to 15 parts of curing agent. The preparation method comprises the following steps of: mixing raw materials, heating to the temperature of between 60 and 80 DEG C, and stirring for 30 to 60 minutes to obtain a product. Compared with the prior art, the epoxy resin composition can effectively package the electronic element; and a packaging material prepared from the epoxy resin composition has high-temperature and high-pressure resistance, bending resistance and high moldability, and is an excellent packaging material for the electronic element.

Description

technical field [0001] The invention relates to a resin composition and a preparation method thereof, in particular to an epoxy resin composition for encapsulating electronic components and a preparation method thereof. Background technique [0002] Polymer compounds containing epoxy groups in their molecular structure are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small set shrinkage, good dimensional stability of products, high hardness, flexibility It has good properties and is stable to alkali and most solvents, so it is widely used in various sectors of national defense and national economy for pouring, impregnation, lamination, adhesives, coatings and other purposes. [0003] Since the performance of epoxy resin is not perfect, at the same time, the objects to which epoxy resin is applied are not...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L63/06C08L63/04C08K3/36C08G59/42C09K3/10
Inventor 顾伟民吴荧
Owner 上海旌纬微电子科技有限公司
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