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Lamination manufacturing method for imbedded inductance magnet ring

A manufacturing method and magnetic ring technology, applied in the field of electronics, can solve the problems of filling the cavity of embedded inductive magnetic ring products, quality cannot be guaranteed, high cost, etc., and achieve the effect of increased bonding strength, reliability assurance, and quality assurance.

Active Publication Date: 2013-01-23
广州市合成电子制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional design and manufacture of circuit boards will often cause voids and insufficient glue filling in the finished embedded inductor magnetic ring. The quality cannot be guaranteed, the yield rate is low, and the cost is high.

Method used

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  • Lamination manufacturing method for imbedded inductance magnet ring
  • Lamination manufacturing method for imbedded inductance magnet ring
  • Lamination manufacturing method for imbedded inductance magnet ring

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing, the present invention is described in further detail with embodiment:

[0025] Taking the inductance magnetic ring as a circle: the outer diameter is 3.55mm, the inner diameter is 1.75mm, and the thickness is 1.55-1.6mm as an example to illustrate the specific implementation:

[0026] A: The first is the design guarantee: according to the size and thickness requirements of the inductance magnetic ring, the design determines the material selection standard of the substrate thickness and the aperture size. Then according to different plate thickness requirements, by calculating the size and quantity of the aperture, the theoretical filling amount of the filling hole during pressing is calculated, and then the quantity of 1080 semi-solid sheet used in pressing is determined.

[0027] The specific design principles are as follows:

[0028] The basic design process is:

[0029] Ⅰ: Use 1.6mm common FR4 copper clad laminate, th...

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Abstract

The invention relates to a lamination manufacturing method for an imbedded inductance magnet ring and aims to solve the problems of frequent holes and uncompleted glue filling because the conventional circuit board manufacturing process is complicated and inaccurate. The method comprises the following steps of: finishing hole position, hole number, hole diameter, hole shape and layout designs by using circuit auxiliary software CAM350; referring according to the size and the thickness of the inductance magnet ring; designing and determining the thickness sorting standard and the hole diametersize of a substrate; estimating the theoretical glue filling amount of a filling hole during lamination through the accounting of the size and the number of holes according to different substrate thickness requirements; determining the number of used half-fixed sheets 1080 during lamination; and imbedding the inductance magnet ring with the outer diameter of 3.55mm manually and laminating according to process requirements. By the manufacturing method, the inductance magnet ring is imbedded at a fixed position on a printed circuit board (PCB), the aim of manufacturing an inductance magnet ringplate can be fulfilled only by the design of wiring on the PCB and the like subsequently and the problems of holes and uncompleted glue filling are solved. The manufactured inductance magnet ring hashigh quality, low cost and high accuracy and is beneficial to popularization.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a lamination manufacturing method of an embedded inductive magnetic ring. Background technique [0002] The traditional circuit board design and production will often cause voids and insufficient filling of the embedded inductor magnetic ring, the quality cannot be guaranteed, the yield rate is low, and the cost is high. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to overcome the deficiencies of the traditional circuit board manufacturing process, and to provide a lamination manufacturing method of embedded inductive magnetic loops, which has the advantages of accurate calculation, scientific process, improved product quality, reduced cost and favorable promotion. [0004] The content of the present invention is: [0005] A; First, use the line auxiliary software CAM350 to complete the layout design of the hole position, number of holes, hole ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/06H05K3/46H05K1/16
Inventor 阙民辉张柏勇
Owner 广州市合成电子制品有限公司
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