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Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board

A technology for printed wiring boards and epoxy resins, applied in the application of non-metallic protective layers, printed circuits, printed circuit manufacturing, etc., can solve problems such as heat resistance, chemical resistance reduction, glass transition temperature reduction, etc. Excellent chemical resistance, improved fillability, and maintenance of bendability

Active Publication Date: 2013-12-25
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, in order to impart sufficient flame retardancy to the composition, a large amount of organophosphorus compound must be used, so the glass transition temperature (Tg) of the cured product is lowered, and heat resistance, chemical resistance, etc. are improved. Lowering the problem

Method used

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  • Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board
  • Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board
  • Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] With (A) epoxy resin (the epoxy resin that has naphthalene skeleton shown in above-mentioned structural formula (1)), (B) epoxy resin curing agent (the aminotriazine novolac resin shown in above-mentioned structural formula (4)), (C) A carbodiimide-modified soluble polyamide, a curing accelerator, and a phosphorus-based flame retardant (phosphazene) were added to a container and mixed to prepare an epoxy resin for printed wiring boards with a solid content of 33% by mass. Varnishes for resin compositions.

Embodiment 2

[0132] With (A) epoxy resin (the epoxy resin that has naphthalene skeleton shown in above-mentioned structural formula (1)), (B) epoxy resin curing agent (the aminotriazine novolac resin shown in above-mentioned structural formula (4)), (C) A carbodiimide-modified soluble polyamide, a curing accelerator, and a phosphorus-based flame retardant (phosphazene) were added to a container and mixed to prepare an epoxy resin for printed wiring boards with a solid content of 33% by mass. Varnishes for resin compositions.

Embodiment 3

[0134] With (A) epoxy resin (the epoxy resin that has naphthalene skeleton shown in above-mentioned structural formula (1)), (B) epoxy resin curing agent (the aminotriazine novolac resin shown in above-mentioned structural formula (4)), (C) A carbodiimide-modified soluble polyamide, a curing accelerator, and a phosphorus-based flame retardant (phosphazene) were added to a container and mixed to prepare an epoxy resin for printed wiring boards with a solid content of 27% by mass. Varnishes for resin compositions.

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Abstract

The present invention provides an epoxy resin composition for printed wiring boards capable of improving storage stability, adhesiveness, flexibility, and fillability. This invention relates to the epoxy resin composition for printed wiring boards. The composition contains (A) an epoxy resin, (B) an epoxy resin curing agent, and (C) a carbodiimide-modified soluble polyamide as essential components.

Description

technical field [0001] The present invention relates to an epoxy resin composition for printed wiring boards, a solder resist composition, a resin film, a resin sheet, a prepreg, and a resin-coated metal foil ( Resin sheets with metal foils) and cover layers, and flexible printed wiring boards formed using these substances. Background technique [0002] Many flexible printed wiring boards are used in small and thin electronic devices. Recently, due to demands for higher densities and thinner profiles, the demand for multilayer flexible printed wiring boards has increased, and the quality requirements and cost have become stricter. Conventionally, bonding sheets and coverlays are known as multilayer materials for flexible printed wiring boards. These bonding sheets and coverlays used as insulating construction materials require not only press moldability such as storage stability, through-hole and circuit filling properties, but also bendability, heat resistance, and chemica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/20C08G59/46C08G69/48C08J5/24C08L61/14C08L63/04C08L71/10C08L77/00H05K1/03H05K3/28
CPCH05K3/4652H05K3/4655H05K1/0353C08G69/48C08J2363/00C08L63/00C08J5/24C08L77/00C08J5/244C08J5/249C08L2666/20C08L2666/22
Inventor 小关高好石川阳介奥野真司江崎义昭伊藤克彦
Owner PANASONIC CORP